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Small stirring and glue filling device of epoxy resin AB glue

An epoxy resin, small technology, applied in the direction of roads, road repair, roads, etc., can solve the problems of restricting large-scale application, large temperature and environmental impact, becoming viscous, etc., to achieve the effect of simple structure and convenient operation

Inactive Publication Date: 2019-03-12
CHANGAN UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Epoxy thin-layer pavement structure is mainly a new technology that uses epoxy resin to bond aggregates to the bridge deck or road surface. Generally, the pavement thickness is between 4 and 20 mm, and the aggregate particle size is between 1 and 5 mm. At present, there is no special construction equipment for this kind of paving technology. On the one hand, epoxy resin colloid is greatly affected by the temperature environment, and it will become sticky at low temperature, and it is not easy to remove when it adheres to the equipment box. On the other hand, the spreading of crushed stones The amount is not easy to control
Therefore, to a certain extent, the large-scale application of this technology is limited.

Method used

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  • Small stirring and glue filling device of epoxy resin AB glue

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Embodiment Construction

[0015] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0016] see figure 1 , the epoxy resin AB glue small-scale mixing and glue filling device of the present invention comprises a mixing drum 4, which is provided with a stirring blade 15 capable of moving up and down in the middle of the mixing drum 4, and the stirring blade 15 is connected to the blade telescopic rod 9, and the blade telescopic rod 9 passes The blade telescopic device 10 is connected with the rotating shaft 12 . The motor drives the stirring blade 15 to rotate through the rotating shaft 12, and a reducer 11 is arranged between the rotating shaft 12 and the motor. The top of the mixing drum 4 is provided with a sealing cover 7 that can move up and down along the cylinder wall. The sealing cover 7 is composed of two semicircular cover plates. The opening and closing of the sealing cover 7 is controlled by an on-off valve 16 . The bottom of the ...

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Abstract

The invention discloses a small stirring and glue filling device of epoxy resin AB glue. The small stirring and glue filling device comprises a stirring tube, and stirring blades capable of moving vertically are arranged in the stirring tube; a motor drives the stirring blades to rotate through a rotating shaft, and a sealing cover capable of vertically moving along the tube wall is arranged at the top of the stirring tube; an insert piece is arranged at the bottom of the stirring tube, and a conical hopper facilitating discharging is arranged below the insert piece; two barrel frames capableof rotating are arranged above the stirring tube, and a sample barrel A and a sample barrel B are mounted through the barrel frames; after the sealing cover is opened, samples of components A and B ofepoxy resin can be poured into the stirring tube; and the stirring tube, the motor, the sample barrel A and the sample barrel B are both mounted on a support, and a tire is mounted on the bottom faceof the support. The small stirring and glue filling device can be applied to construction of epoxy resin anti-sliding thin layers at downhill road sections and sharp turning road sections, the sealing cover can scrape the epoxy resin glue adhering to the inner wall of the stirring tube, the structure is simple, and operation is convenient.

Description

technical field [0001] The invention relates to the field of road construction, in particular to a small-scale mixing and filling device for epoxy resin AB glue. Background technique [0002] Epoxy thin-layer pavement structure is mainly a new technology that uses epoxy resin to bond aggregates to the bridge deck or road surface. Generally, the pavement thickness is between 4 and 20mm, and the aggregate particle size is between 1 and 5mm. At present, there is no special construction equipment for this pavement technology. On the one hand, the epoxy resin colloid is greatly affected by the temperature environment, and the low temperature will become sticky, and it is not easy to remove when it adheres to the equipment box. On the other hand, the spreading of crushed stones Quantity is not easy to control. Therefore, the large-scale application of this technology is limited to a certain extent. Contents of the invention [0003] The object of the present invention is to so...

Claims

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Application Information

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IPC IPC(8): E01C19/10E01C19/17
CPCE01C19/104E01C19/17
Inventor 吴喜荣郑南翔张强王慧鑫宋茂林崔晓如魏鑫杜光李向男荣亚鹏陈毅高学凯张必昌冀慧
Owner CHANGAN UNIV