All-inorganic LED lamp and packaging method thereof

A technology of LED lamps and packaging methods, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., and can solve problems such as the inappropriateness of ultraviolet LED chips

Active Publication Date: 2019-03-15
广州市鸿利秉一光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problems existing in the prior art, the present invention provides an all-inorganic LED lamp and its packaging method, which solve

Method used

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  • All-inorganic LED lamp and packaging method thereof
  • All-inorganic LED lamp and packaging method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] like figure 1 and figure 2 As shown, an all-inorganic LED lamp includes a base 1, a groove is opened on the base 1 to form a bowl 2 or a dam provided on the base 1 forms a bowl 2, and the bowl 2 is provided with an ultraviolet The LED chip 3 and the ultraviolet LED chip 3 are electrically connected to the base 1 .

[0026] The glass cover plate 4 is a monolithic glass structure, a glass cover plate provided with a metal layer or a glass cover plate provided with a metal frame, and the glass in the glass cover plate 4 is a monolithic planar hard glass or a glass lens, and the glass lens is opposite to the The laser has a focused effect and is suitable for directional applications.

[0027] The surface of the bowl 2 is coated with solder 5 with a thickness of 0.02-0.5 mm. In this embodiment, the solder is metal solder, metal and inorganic mixed solder or sintered silver glue. Under vacuum or inert gas, the glass cover plate 4 Place it on the solder 5 on the bowl cup 2...

Embodiment 2

[0029] like figure 1 and figure 2 As shown, an all-inorganic LED lamp includes a base 1, a groove is opened on the base 1 to form a bowl 2 or a dam provided on the base 1 forms a bowl 2, and the bowl 2 is provided with an ultraviolet The LED chip 3 and the ultraviolet LED chip 3 are electrically connected to the base 1 .

[0030]The glass cover plate 4 is a glass cover plate provided with a metal layer or a glass cover plate provided with a metal frame, and the surface of the bowl cup 2 is coated with a solder 5 with a thickness of 0.02-0.5 mm. In this embodiment, the solder is selected from metal solder, Metal and inorganic mixed solder or sintered silver glue, under vacuum or inert gas, place the glass cover 4 on the solder 5 on the bowl cup 2, and weld one or more pre-soldered spots on the glass cover 4 with laser , the pre-soldering spots are evenly distributed around the glass cover plate 4 and symmetrically distributed relative to the glass cover plate 4, the glass co...

Embodiment 3

[0032] like figure 1 and figure 2 As shown, the present invention also provides a method for encapsulating an all-inorganic LED lamp, comprising the following steps:

[0033] S1. Pretreatment: including preparing the base 1 with the bowl cup 2 and the ultraviolet LED chip 3; preparing the glass cover 4, the glass cover 4 is a whole glass structure, a glass cover with a metal layer or a metal The glass cover plate of the frame, and the glass in the glass cover plate 4 is a whole piece of flat hard glass or glass lens, and the glass lens has a gathering effect on the laser light, which is suitable for directional applications;

[0034] S2, fixing the ultraviolet LED chip 3 in the bowl cup 2;

[0035] S3, coating the solder 5 on the surface of the bowl cup 2, the coating thickness of the solder 5 is 0.02-0.5 mm;

[0036] S4. In a vacuum or an inert gas environment, vacuumize the vacuum environment, and the inert gas can be nitrogen, etc., and place the glass cover plate 4 on ...

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Abstract

The invention provides an all-inorganic LED lamp and a packaging method thereof. The all-inorganic LED lamp comprises a base and an LED chip; the base is provided with a bowl; the LED chip is arrangedinside the bowl and electrically connected with the base; a glass cover plate for sealing the LED chip is arranged on the bowl; and the surface of the bowl is coated with a solder, and the glass cover is bonded to the bowl through the solder. According to the all-inorganic LED lamp provided by the invention, the glass cover plate and the bowl are bonded together through the solder, so that the application of organic materials such as silica gel can be avoided, and the all-inorganic LED lamp can be used for packaging of devices which are not suitable for being packaged by using organic material, and solves the problem that related device packaging materials are easy to age and go bad in a severe environment.

Description

technical field [0001] The invention belongs to the field of LED lighting, and in particular relates to an all-inorganic LED lamp and a packaging method thereof. Background technique [0002] LED has excellent characteristics such as small size, high efficiency, strong applicability, good stability, short response time, long life, and no pollution to the environment, so it is widely used in people's daily life. In recent years, with the improvement of people's living standards Improvement, UV LEDs have the functions of sterilization, anti-counterfeiting, curing, etc., so the application of UV LEDs is becoming more and more extensive. At present, the packaging of LEDs mostly uses organic materials such as silica gel and epoxy resin to seal and protect the LED chips. These materials are light-transmitting Good performance, easy to operate, can increase the amount of light output, and has high requirements for packaging conditions. If the curing temperature is high, the curing ...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L33/48
CPCH01L33/005H01L33/48
Inventor 任荣斌汤乐明何绍勇陈华斌熊科吴乾
Owner 广州市鸿利秉一光电科技有限公司
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