Copper-based nickel plating-gold plating layer waste plating piece metal gradient recovery method

A gold-plated layer and nickel-plated technology, which is applied in the field of waste recycling, can solve problems such as difficult control of the dissolution and separation process, increased operating costs, and highly toxic cyanide system, so as to eliminate the use of nitric acid or concentrated nitric acid and promote healthy development. Good selective separation effect

Active Publication Date: 2019-03-19
NORTHEASTERN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] As a surface treatment technology, electroplating is widely used in the manufacturing process of electrical components, electronic equipment, communication equipment and instruments to improve the technical parameters and performance of devices; in order to meet certain specific technical performance requirements while saving rare and precious metals Resources, the surface of the device substrate is often plated with multiple layers of metal; after a long period of use, the replaced old or damaged plating, as a precious and enriched resource, needs to be separated and recycled from the plating layer and the substrate metal to achieve a certain degree of economy value and resource sustainable utilization; in the traditional deplating recovery technology, the method of deplatin

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A kind of copper-based nickel-plated layer waste plated piece gradient recovery metal method, comprises the following steps:

[0025] Step 1. Put the plated parts into ethanol to clean, remove the surface oil, and then clean with deionized water;

[0026] Step 2, carrying out gold-dissolving treatment to the plated parts after cleaning;

[0027] Step 2.1, preparing gold-dissolving liquid, its composition is in molar concentration meter: sodium thiosulfate 0.05mol / L, copper sulfate 0.02mol / L, ammoniacal liquor 0.5mol / L, ammonium sulfate 0.05mol / L and triethanolamine 0.02mol / L , and the rest is deionized water;

[0028] Step 2.2, adjusting the pH value of the gold-dissolving solution to 9.5;

[0029] Step 2.3, put the gold-dissolving solution in the reactor, immerse the plated piece in the gold-dissolving solution, the mass ratio of the plated piece to the gold-dissolving solution volume ratio is 60g / L; then carry out magnetic stirring, and the plated piece is immersed ...

Embodiment 2

[0038] A kind of copper-based nickel-plated layer waste plated piece gradient recovery metal method, comprises the following steps:

[0039] Step 1. Put the plated parts into ethanol to clean, remove the surface oil, and then clean with deionized water;

[0040] Step 2, carrying out gold-dissolving treatment to the plated parts after cleaning;

[0041] Step 2.1, preparation of gold-dissolving liquid, its composition in molar concentration meter: sodium thiosulfate 0.1mol / L, copper sulfate 0.05mol / L, ammonia water 0.75mol / L, ammonium sulfate 0.1mol / L and triethanolamine 0.075mol / L , and the rest is deionized water;

[0042] Step 2.2, adjusting the pH value of the gold-dissolving solution to 10.0;

[0043] Step 2.3, put the gold-dissolving solution in the reactor, immerse the plated piece in the gold-dissolving solution, the mass ratio of the plated piece to the gold-dissolving solution volume ratio is 80g / L; then carry out magnetic stirring, place the plated piece in the hang...

Embodiment 3

[0052] A kind of copper-based nickel-plated layer waste plated piece gradient recovery metal method, comprises the following steps:

[0053] Step 1. Put the plated parts into ethanol to clean, remove the surface oil, and then clean with deionized water;

[0054] Step 2, carrying out gold-dissolving treatment to the plated parts after cleaning;

[0055] Step 2.1, preparing gold-dissolving liquid, its composition is in terms of molar concentration: potassium thiosulfate 0.2mol / L, copper sulfate 0.05mol / L, ammonia water 1.0mol / L, ammonium sulfate 0.15mol / L and triethanolamine 0.1mol / L , and the rest is deionized water;

[0056] Step 2.2, adjusting the pH value of the gold-dissolving solution to 10.5;

[0057] Step 2.3, put the gold-dissolving solution in the reactor, immerse the plated piece in the gold-dissolving solution, the mass ratio of the plated piece to the gold-dissolving solution volume ratio is 100g / L; then carry out mechanical stirring, and the plated piece is immer...

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Abstract

The invention belongs to the technical field of waste recycling and discloses a copper-based nickel plating-gold plating layer waste plating piece metal gradient recovery method. The method comprisesthe following steps of 1, putting plating pieces into ethyl alcohol to conduct cleaning to remove surface greasy dirt and then conducting cleaning through deionized water; 2, conducting gold solutiontreatment on the cleaned plating pieces; 3, conducting nickel solution treatment on the plating pieces subjected to gold solution treatment; 3.1, washing the surfaces of the plating pieces subjected to gold solution treatment through deionized water. Through the copper-based nickel plating-gold plating layer waste plating piece metal gradient recovery method, reaction is controllable; a gold plating layer on the outermost side of a base body can be quickly and selectively removed in priority, corrosion dissolution to a metallic nickel layer under the gold plating layer is small, and the purpose of separating and recycling metallic gold is achieved; the metallic nickel layer on the surface of each degolded plating piece is selectively separated and recycled; and finally, selective separation and recycling of gold, nickel and copper in the plating pieces are realized.

Description

technical field [0001] The invention belongs to the technical field of recycling waste materials, and in particular relates to a method for recovering metals from waste plated parts with a copper-based nickel-gold plating layer in a gradient manner. Background technique [0002] As a surface treatment technology, electroplating is widely used in the manufacturing process of electrical components, electronic equipment, communication equipment and instruments to improve the technical parameters and performance of devices; in order to meet certain specific technical performance requirements while saving rare and precious metals Resources, the surface of the device substrate is often plated with multiple layers of metal; after a long period of use, the replaced old or damaged plating, as a precious and enriched resource, needs to be separated and recycled from the plating layer and the substrate metal to achieve a certain degree of economy value and resource sustainable utilizat...

Claims

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Application Information

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IPC IPC(8): C22B7/00C22B11/00C22B23/00C22B15/00
CPCC22B7/007C22B7/008C22B11/042C22B15/0069C22B15/0078C22B23/0423Y02P10/20
Inventor 杨洪英金哲男赵鹤飞佟琳琳
Owner NORTHEASTERN UNIV
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