OSP copper surface antioxidant and preparation method thereof

A copper surface antioxidant and zinc iodide technology, which is applied in the manufacture of printed circuits, electrical components, printed circuits, etc., can solve the problems of poor high temperature resistance, high cost of antioxidants, unfavorable multiple welding, etc., to increase glossiness, Low production cost and the effect of preventing crystallization of the bath solution

Inactive Publication Date: 2019-03-19
南通赛可特电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the traditional copper surface antioxidant has high cost and poor high temperature resistance, which is not conducive to repeated welding

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] OSP copper surface antioxidant is composed of the following raw materials in parts by weight:

[0031] Copper acetate 0.2kg;

[0032] Zinc acetate 0.5kg;

[0033] Dip-chlorobenzylbenzimidazole 1kg;

[0034] N-heptanoic acid 0.5kg;

[0035] Glacial acetic acid 20kg;

[0036] Formic acid 1kg

[0037] Zinc iodide 0.001kg.

[0038] OSP copper surface antioxidant, the specific preparation steps are:

[0039] Prepare solution ①:

[0040] 1.1 Take a small mixing bucket, add a specified amount of glacial acetic acid; add a specified amount of formic acid and stir evenly;

[0041] 1.2 Measure the specified amount of orthogamic acid and slowly add it while stirring, as long as there is no oily flower and no oily liquid sticking to the wall when adding orthogamic acid, continue stirring for 30 minutes;

[0042] 1.3 Add a specified amount of di-p-chlorobenzylbenzimidazole and a specified amount of zinc acetate and stir thoroughly for 60 minutes until the solid is completely...

Embodiment 2

[0050] OSP copper surface antioxidant is composed of the following raw materials in parts by weight:

[0051] Copper acetate 5kg;

[0052] Zinc acetate 5kg;

[0053] Two p-chlorobenzylbenzimidazole 8kg;

[0054] N-heptanoic acid 10kg;

[0055] Glacial acetic acid 200kg;

[0056] Formic acid 20kg

[0057] Zinc iodide 0.1kg.

[0058] OSP copper surface antioxidant, the specific preparation steps are:

[0059] Prepare solution ①:

[0060] 1.1 Take a small mixing bucket, add a specified amount of glacial acetic acid; add a specified amount of formic acid and stir evenly;

[0061] 1.2 Measure the specified amount of orthogamic acid and slowly add it while stirring, as long as there is no oily flower and no oily liquid sticking to the wall when adding orthogamic acid, continue stirring for 30 minutes;

[0062] 1.3 Add a specified amount of di-p-chlorobenzylbenzimidazole and a specified amount of zinc acetate and stir thoroughly for 60 minutes until the solid is completely di...

Embodiment 3

[0070] OSP copper surface antioxidant is composed of the following raw materials in parts by weight:

[0071] Copper acetate 3kg;

[0072] Zinc acetate 2kg;

[0073] Two p-chlorobenzylbenzimidazole 5kg;

[0074] N-heptanoic acid 6kg;

[0075] Glacial acetic acid 50kg;

[0076] Formic acid 10kg

[0077] Zinc iodide 0.05kg.

[0078] OSP copper surface antioxidant, the specific preparation steps are:

[0079] Prepare solution ①:

[0080] 1.1 Take a small mixing bucket, add a specified amount of glacial acetic acid; add a specified amount of formic acid and stir evenly;

[0081] 1.2 Measure the specified amount of orthogamic acid and slowly add it while stirring, as long as there is no oily flower and no oily liquid sticking to the wall when adding orthogamic acid, continue stirring for 30 minutes;

[0082]1.3 Add a specified amount of di-p-chlorobenzylbenzimidazole and a specified amount of zinc acetate and stir thoroughly for 60 minutes until the solid is completely diss...

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PUM

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Abstract

The invention discloses an OSP copper surface antioxidant. The OSP copper surface antioxidant is prepared form the following raw materials in parts by weight: 0.2-5kg of copper acetate, 0.5-5kg of zinc acetate, 1-8kg of dip-chlorobenzyl benzimidazole, 0.5-10kg of heptanoic acid, 20-200kg of glacial acetic acid, 1-20kg of formic acid and 0.001-0.1kg of zinc iodide. A preparation method of the OSP copper surface antioxidant comprises the specific preparation steps that a solution (1) is prepared, specifically, 1.1, a small stirring barrel is taken and added with glacial acetic acid, and the formic acid is added and stirred evenly; 1.2, heptanoic acid is added slowly and stirred, continually stirring is carried out for 30 minutes; 1.3, dip-chlorobenzyl benzimidazole and zinc acetate are addedand fully stirred for 60 minutes until solids are completely dissolved, and thus the solution (1) is obtained; 1.4, a small amount of the solution (1) is utilized to clean a heptanoic acid measuringtool in the solution (1) step; 1.5, the solution (1) is added into a large stirring barrel; a solution (2) is prepared, specifically, 1.6, 850 L of pure water is taken, copper acetate is completely dissolved, stirring is carried out for 60 minutes, and the solution (2) is obtained; and 1.7, the solution (2) is slowly added into the large stirring barrel containing the solution (1), stirring is carried out while adding is carried out, uniform stirring is carried out, and the zinc iodide is slowly added for not less than 20 minutes. The OSP copper surface antioxidant has the advantages of low cost and good high temperature resistance.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to an OSP copper surface antioxidant and a preparation method thereof. Background technique [0002] Printed Circuit Board (PCB) is one of the important components of the electronics industry and is the support of electronic components. Antioxidants are mainly used to prevent the copper surface of the circuit board from being oxidized and discolored in the air. The processed printed circuit board also needs to ensure that the soldering function is not affected. However, the traditional copper surface antioxidant has high cost and poor high temperature resistance, which is not conducive to repeated welding. Contents of the invention [0003] Purpose of the invention: The purpose of the invention is to solve the deficiencies in the prior art and provide a low cost and good high temperature resistance. OSP copper surface antioxidant and preparation method thereof. [0004] T...

Claims

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Application Information

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IPC IPC(8): C23C22/52H05K3/28
CPCC23C22/52H05K3/282H05K2203/0789
Inventor 刘政刘波隋广宇
Owner 南通赛可特电子有限公司
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