The invention discloses an OSP
copper surface
antioxidant. The OSP
copper surface
antioxidant is prepared form the following raw materials in parts by weight: 0.2-5kg of
copper acetate, 0.5-5kg of
zinc acetate, 1-8kg of dip-chlorobenzyl
benzimidazole, 0.5-10kg of
heptanoic acid, 20-200kg of glacial
acetic acid, 1-20kg of
formic acid and 0.001-0.1kg of
zinc iodide. A preparation method of the OSP copper surface
antioxidant comprises the specific preparation steps that a solution (1) is prepared, specifically, 1.1, a small stirring
barrel is taken and added with glacial
acetic acid, and the
formic acid is added and stirred evenly; 1.2,
heptanoic acid is added slowly and stirred, continually stirring is carried out for 30 minutes; 1.3, dip-chlorobenzyl
benzimidazole and
zinc acetate are addedand fully stirred for 60 minutes until solids are completely dissolved, and thus the solution (1) is obtained; 1.4, a small amount of the solution (1) is utilized to clean a
heptanoic acid measuringtool in the solution (1) step; 1.5, the solution (1) is added into a large stirring
barrel; a solution (2) is prepared, specifically, 1.6, 850 L of pure water is taken, copper acetate is completely dissolved, stirring is carried out for 60 minutes, and the solution (2) is obtained; and 1.7, the solution (2) is slowly added into the large stirring
barrel containing the solution (1), stirring is carried out while adding is carried out, uniform stirring is carried out, and the
zinc iodide is slowly added for not less than 20 minutes. The OSP copper surface antioxidant has the advantages of low cost and good high
temperature resistance.