A liquid-cooled heat dissipation circulation loop device for blade server

Abstract

The invention discloses a liquid cooling heat dissipation circulation loop device for a blade server. The liquid cooling heat dissipation circulation loop device comprises a liquid supply main pipe; aliquid return main pipe; valves located at the upper and lower ends of the liquid supply main pipe and the liquid return main pipe; exhaust valves located at the upper ends of the liquid supply mainpipe and the liquid return main pipe; a first branch liquid supply pipe and a first branch liquid return pipe which are successively connected to the liquid supply main pipe and the liquid return mainpipe; a second branch liquid supply pipe and a second branch liquid return pipe which are successively connected to the first branch liquid supply pipe and the second branch liquid return pipe; a heat pipe unit; and a monitoring alarm unit. The loop device disclosed by the invention is suitable for a blade server using a heat pipe module, is simple and reliable, facilitates the disassembly and maintenance of the blade server, improves heat dissipation efficiency, and greatly reduces the cooling energy consumption of a machine room and liquid cooling potential safety hazards.

Description

technical field [0001] The invention belongs to the technical field of computer room heat dissipation, and in particular relates to a liquid cooling heat dissipation device for a blade server. Background technique [0002] With the increase of data center scale and cabinet power density, the heat dissipation and energy consumption of data centers (also known as computer rooms) has attracted more and more attention and attention. At present, the existing technology is mainly designed for the heat dissipation of the whole computer room or a single cabinet, such as air-cooled air conditioners, water-cooled air conditioners, space between columns, liquid-cooled backplanes, etc., all of which can be attributed to the heat dissipation modes of the computer room level and the cabinet level, so they cannot be effectively It effectively solves the local heat dissipation problem of countless server chips in the cabinet and realizes the effective control of the working temperature unde...

AI Technical Summary

Problems solved by technology

[0004] At present, the chip-level heat dissipation technology of blade servers used for high-performance computing needs mainly adopts direct single-phase liquid cooling technology; while the chip-level heat dissipation technology based on high-performance heat pipe modules is not yet mature and can be applied to blade servers. The complete cabinet liquid-cooled heat dissipation circulation circuit coupled with it has not yet been developed and has not been publicly reported.

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