Multi-substrate alignment printing method and alignment printing machine

Abstract

The invention discloses a multi-substrate alignment printing method and an alignment printing machine. The alignment printing machine comprises a machine frame, a platform module, conveying guide rails and a CCD module, the platform module capable of ascending and descending is arranged on the machine frame, the conveying guide rails are used for conveying a jig loaded with substrates to the center of the printing machine, the CCD module is used for sucking and positioning the substrates, a lower suction nozzle platform is arranged on the platform module, a plurality of lower suction nozzles are arranged on the lower suction nozzle platform at intervals, the lower suction nozzle platform is located between the two transportation guide rails. According to the alignment printing machine, a plurality of lower suction nozzles and a single upper suction nozzle are adopted and are independently controlled by electromagnetic valves, the adsorption adjustment of the lower suction nozzles and the upper suction nozzle needs to be used for each adjustment of the substrate, independent adjustment and printing of a plurality of substrates are realized, the product is detected and adjusted for multiple times through the CCD, the position of the base plate and the position of the steel net are repeatedly confirmed, so that the printing position of the base plate can be ensured.

Description

Technical field [0001] The invention relates to a printing machine, in particular to a multi-substrate registration printing method and a registration printing machine. Background technique [0002] The solder paste printer is generally composed of board loading, solder paste, imprinting and circuit board transfer; its working principle is: first fix the printed circuit board on the printing positioning table, and then use the left and right scrapers of the printer to handle Solder paste or red glue is printed on the corresponding pad through the stencil, and the evenly missed PCB is input to the placement machine through the transmission table for automatic placement; in the prior art, the SMT solder paste printing industry generally uses a single camera to do For the phase and alignment of the solder paste printer, the single camera needs to take the phase mark (Mark) twice or even three times on the printed circuit board respectively. After obtaining the coordinates of the pri...

AI Technical Summary

Problems solved by technology

[0002] The solder paste printing machine is generally composed of board loading, solder paste, embossing and circuit board delivery; its working principle is: first fix the circuit board to be printed on the printing positioning table, and then the left and right scrapers of the printing machine will Solder paste or red glue is printed on the corresponding pads through the stencil, and the evenly printed PCB is input to the placement machine through the transmission table for automatic placement; in the prior art, the SMT solder paste printing industry generally uses a single camera to carry out For the phase acquisition and alignment of the solder paste printing machine, a single camera needs to capture the phase mark (Mark) twice or even three times on the printed substrate. After obtaining the coordinate

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