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Thin chip vacuum packaging structure

A vacuum packaging and vacuum sealing technology, which is applied in the field of semiconductor manufacturing, can solve the problems of high production cost, large thickness, and large volume, and achieve the effects of reducing volume, meeting miniaturization, and reducing packaging costs

Pending Publication Date: 2019-04-02
XINFOO SENSOR TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, the manufacturing process of this packaging structure is complicated, the production cost is high, the volume is large, and the thickness is large, so it is not suitable for portable electronic products.

Method used

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  • Thin chip vacuum packaging structure
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Embodiment Construction

[0022] Combine below figure 1 Referring to FIG. 7 , the embodiment of the present invention and the specific operation process are described in detail, but the scope of protection of the present invention is not limited to the following examples.

[0023] The invention discloses a thin chip vacuum packaging structure, such as figure 1 As shown, it includes a substrate 1, a cover plate 2, a cofferdam 3 and a getter 4, and related circuits are pre-formed on the substrate 1, and the substrate 1, the cover plate 2 and the cofferdam 3 are bonded to form a vacuum sealed cavity body, the substrate 1 is provided with a chip sensing area 6 and a first metal pad 5, the chip sensing area 6 and getter 4 are placed in a vacuum-sealed cavity, and the first metal pad 5 is set on the periphery of the vacuum-sealed cavity.

[0024] In the embodiment of the present invention, the getter 4 is adhered on the cover plate 2, and the getter 4 Activated to absorb the gas released inside the cavity...

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PUM

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Abstract

The invention discloses a thin chip vacuum packaging structure, which comprises a substrate, a cover plate, a cofferdam and a getter, and is characterized in that the substrate, the cover plate and the cofferdam form a vacuum sealing chamber by bonding, the substrate is provided with a chip sensing region and a first metal pad, the chip sensing region and the getter are placed in the vacuum sealing chamber, and the first metal pad is arranged at the periphery of the vacuum sealing chamber. The first metal pad is arranged on the substrate at the periphery of the sealing chamber, and the vacuumsealing only needs to be performed on the chip sensing region, so that the internal space of the vacuum packaging and the volume of the packaging structure are reduced, the packaging cost is lowered,and the requirements of portable electronic products for the minimization of the chip packaging structure are met.

Description

technical field [0001] The invention belongs to the field of semiconductor manufacturing, and in particular relates to a thin chip vacuum packaging structure. Background technique [0002] With the rapid development of MEMS technology, various MEMS device products are used as high-quality sensors or detectors in industrial remote sensing, image communication, consumer electronics, automotive industry, military industry and other fields. Many sensors require high-vacuum, small-volume packages. The traditional vacuum packaging structure usually uses a metal shell or a ceramic shell as a sealed cavity to package the chip. Its main feature is that Die is placed inside the metal or ceramic shell and welded to the pad inside the shell through WireBong leads. Then cover the cover plate on the tube shell to isolate the external atmospheric environment. At present, the manufacturing process of this packaging structure is complicated, the production cost is high, the volume is large...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/00
CPCB81B7/0006B81B7/0038
Inventor 韩磊赵照
Owner XINFOO SENSOR TECH CO LTD
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