Display panel, display device and display panel preparation method
A technology of display panel and packaging structure, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve the problem that the separation between layers cannot well cover the to-be-packaged area of the device to be packaged, etc., so as to reduce water and oxygen The effect of reducing the risk of material damage, improving adhesion, and reducing the probability of intrusion into the display device
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[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0023] In the prior art, the bonding between the packaging structure of the display panel and the device to be packaged (that is, the display device) is mainly achieved by using an adhesive material. Therefore, in the actual bending process, the packaging structure and the device to be packaged are extremely tight. Separation between layers is prone to occur, thereby greatly reducing the encapsulation capability of the encapsulation structure.
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