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Display panel, display device and display panel preparation method

A technology of display panel and packaging structure, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve the problem that the separation between layers cannot well cover the to-be-packaged area of ​​the device to be packaged, etc., so as to reduce water and oxygen The effect of reducing the risk of material damage, improving adhesion, and reducing the probability of intrusion into the display device

Active Publication Date: 2019-04-02
YUNGU GUAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, an embodiment of the present invention provides a display panel, a display device, and a method for manufacturing a display panel, so as to solve the problem that interlayer separation easily occurs between the packaging structure of the existing display panel and the device to be packaged, and the existing packaging structure cannot Good coverage of the area to be packaged for the device to be packaged

Method used

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  • Display panel, display device and display panel preparation method
  • Display panel, display device and display panel preparation method
  • Display panel, display device and display panel preparation method

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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0023] In the prior art, the bonding between the packaging structure of the display panel and the device to be packaged (that is, the display device) is mainly achieved by using an adhesive material. Therefore, in the actual bending process, the packaging structure and the device to be packaged are extremely tight. Separation between layers is prone to occur, thereby greatly reducing the encapsulation capability of the encapsulation structure.

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Abstract

The invention provides a display panel, a display device and a display panel preparation method. The display panel comprises a packaging structure and a to-be-packaged device; a to-be-packaged area ofthe to-be-packaged device comprises a to-be-packaged surface and a to-be-packaged bulge adjacent to the to-be-packaged surface; an acute angled chamfering area is arranged between the to-be-packagedbulge and the to-be-packaged surface; the packaging structure comprises an inorganic layer and an organic layer alternately laminated with the inorganic layer; the inorganic layers comprise a first inorganic layer; the first inorganic layer is adjacent to the to-be-packaged area; and the first inorganic layer completely covers the to-be-packaged area. The display panel provided by the embodimentsnot only effectively improves the adhesion force between the packaging structure and the to-be-packaged device, but also sufficiently ensuring the ability of blocking substances such as water and oxygen by the packaging structure, thereby reducing the risk that display devices are damaged by the substances such as water and oxygen.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a display panel, a display device and a method for preparing a display panel. Background technique [0002] Because Organic Light-Emitting Diode (OLED) has the characteristics of self-luminescence, short response time, high luminous efficiency, flexible panels, and wide color gamut, it is often applied to display devices with flexible bending capabilities. . However, OLED display devices are prone to failure after being affected by substances such as water and oxygen, so a good packaging structure is required for protection. [0003] However, since both the existing packaging structure and the OLED display device include multiple film layers, and the adhesion between the existing packaging structure and the OLED display device is weak, in the actual bending process, the existing packaging structure It is very easy to have interlayer separation between OLED and OLED display dev...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/32H01L51/52
CPCH10K59/12H10K50/846H10K50/84
Inventor 朱可
Owner YUNGU GUAN TECH CO LTD