A method for capturing expansion and contraction data of multi-layer boards and a method for making multi-layer boards

A technology of expansion and contraction data and production methods, which is applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc. The effect of improving the alignment between layers and improving the alignment accuracy

Active Publication Date: 2020-04-21
SHENZHEN KINWONG ELECTRONICS
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0009] The purpose of the present invention is to provide a method for grabbing expansion and contraction data of multilayer boards, aiming to solve the technical problems that the layer deviation cannot be controlled and the obtained expansion and contraction data are inaccurate in the production process of multilayer boards

Method used

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  • A method for capturing expansion and contraction data of multi-layer boards and a method for making multi-layer boards
  • A method for capturing expansion and contraction data of multi-layer boards and a method for making multi-layer boards
  • A method for capturing expansion and contraction data of multi-layer boards and a method for making multi-layer boards

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Embodiment Construction

[0037] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0038] It should be noted that when a component is referred to as being “fixed on” or “disposed on” another component, it may be directly or indirectly on the other component. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. are based on the orientation or positional relationship shown in the drawings, and are for convenience of description only, rather than indicating or implying the referred device Or ele...

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Abstract

The invention is suitable for the technical field of printed circuit boards, and provides a capture method for laminating sizing data of a multilayer board and a manufacturing method of the multilayerboard. According to the capture method for laminating sizing data of the multilayer board, engineering data is optimally designed; pre-compensation coefficients are not set for sizing test targets and interlayer registration rings; at least one group of fusion positions is added for each of long edges and short edges corresponding to process edges of core materials and the plurality of core materials are prefixed by adoption of a fusion manner; and after lamination, sizing data of the sizing test targets is measured and deflection conditions of the interlayer registration rings are compared.According to the capture method, the engineering data is optimally designed, the distance between the sizing test targets are measured and the deflection conditions of the interlayer registration rings are compared after the lamination, and the obtained sizing data is used as pre-releasing data for carrying out pre-compensation on subsequent products, so that the interlayer registration of the lamination of the multilayer board can be improved, thereby improving the alignment precision of the multilayer board and ensuring the uniqueness of signal transmission of the multilayer board.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and in particular relates to a method for capturing expansion and contraction data of multilayer boards and a method for manufacturing multilayer boards. Background technique [0002] With the advent of the 5G era, PCB (Printed Circuit Board, printed circuit board) circuit design has been transformed from wire design to signal line design. This transformation has increasingly high requirements for PCB design and manufacturing processes. Especially for multi-layer high-frequency boards, layer deviation will cause impedance discontinuity, large crosstalk, and incomplete signal transmission, resulting in signal distortion and seriously affecting the uniqueness of signal transmission. Therefore, for a high-frequency board laminated with multiple core boards, the alignment between laminated layers is particularly important. [0003] At present, for the lamination of multi-layer boards ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
CPCH05K3/4638H05K2203/068
Inventor 陈前陈晓青张霞王俊
Owner SHENZHEN KINWONG ELECTRONICS
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