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Glue film automatic production line

An automatic production line and adhesive film technology, applied in the direction of sending objects, thin material processing, transportation and packaging, etc., can solve the problems of not being able to observe whether waste materials are cut, increase production costs, and low material utilization, so as to facilitate automated production , Save production costs, improve the effect of utilization

Active Publication Date: 2019-04-05
昆山域之光电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] During the cutting process of the existing film, it is impossible to observe whether the waste material is cut, and the material on both sides of the film cannot be used after being punched by the positioning pin of the die-cutting device, and the utilization rate of the material is low, which increases to a certain extent. Cost of production

Method used

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  • Glue film automatic production line
  • Glue film automatic production line
  • Glue film automatic production line

Examples

Experimental program
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Effect test

Embodiment

[0049] Embodiment: a kind of film automatic production line, as Figure 1-Figure 12 As shown, it includes a feeding device 1, a small hole die-cutting device 2, a first waste discharge device 3, an inner frame die-cutting device 4, a second waste discharge device 5 and a release film die-cutting device 6, and the feeding device 1 is located upstream of the small hole die-cutting device 2, the small hole die-cutting device 2 is located upstream of the first waste discharge device 3, and the first waste discharge device 3 is located at the inner frame die-cut device 4 Upstream of the inner frame die-cutting device 4 is located upstream of the second waste discharge device 5, and the second waste discharge device 5 is located upstream of the release film die-cutting device 6;

[0050] The feeding device 1 includes a substrate discharge roller 11, a welt tape discharge roller 12, a first belt pressing mechanism 13, a second belt pressing mechanism 14 and a third belt pressing mech...

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PUM

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Abstract

The invention discloses a glue film automatic production line. The glue film automatic production line comprises a feeding device, a small hole die-cutting device, a first waste exhausting device, aninner frame die-cutting device, a second waste exhausting device and a release film die-cutting device, the feeding device is located at the upstream of the small hole die-cutting device, the small hole die-cutting device is located at the upstream of the first waste exhausting device, and the first waste exhausting device is located at the upstream of the inner frame die-cutting device; and the inner frame die-cutting device is located at the upstream of the second waste exhausting device, the second waste exhausting device is located at the upstream of the release film die-cutting device, the feeding device comprises a bottom material discharging roller, an edge attaching belt discharging roller, a first belt pressing mechanism, a second belt pressing mechanism and a third belt pressingmechanism in sequence according to the production process, a base material rewinding mechanism is arranged at the upper part of the second belt pressing mechanism, and an identification belt discharging roller is arranged above the third belt pressing mechanism. The glue film automatic production line is high in degree of automation, the fast, efficient and high-quality production is achieved, theartificial labor intensity is reduced, the utilization rate of the base material film is improved, and the production cost is saved.

Description

technical field [0001] The invention belongs to the technical field of die-cutting, in particular to an automatic production line for adhesive films. Background technique [0002] Adhesive film is widely used in mobile phones, televisions and other related household appliances industries. The adhesive films on the market are mainly products made by cutting the raw materials of the adhesive film according to the required length. When using a small hole die-cutting device to cut the film, it is necessary to cut the raw material of the film at intervals, then rewind the cut semi-finished product, and finally manually remove the cut waste and then rewind. [0003] During the cutting process of the existing film, it is impossible to observe whether the waste material is cut, and the material on both sides of the film cannot be used after being punched by the positioning pin of the die-cutting device, and the utilization rate of the material is low, which increases to a certain e...

Claims

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Application Information

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IPC IPC(8): B65H41/00B65H35/10B65H37/04
CPCB65H35/10B65H37/04B65H41/00B65H2701/1133B65H2701/1752
Inventor 崔进
Owner 昆山域之光电子有限公司
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