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Floor installing structure and installing method

A technology for installing structures and floors, applied to floors, building structures, partial raised floors, etc., can solve the problems of large ground thickness, impact, long drying cycle, etc., and achieve the effect of reducing thickness

Active Publication Date: 2019-04-05
变形积木(北京)科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Because this traditional ground installation construction process is very time-consuming, and the required drying cycle is also long. In addition, in the installation process of the final decorative surface layer, the requirements for the personal experience and skills of the workers are very high, and the decorative surface layer The wage cost of the installation workers is relatively high, and the thickness of the ground completed by this installation process is relatively large (if the water heating layer is paved, the ground thickness will be 10-12cm, and if the water heating layer is not paved, the ground thickness will be 6-12cm. 8cm)
[0004] For this traditional ground installation process, such as figure 2 and image 3 As shown, through some prefabricated decoration methods on the market, the ground is not leveled by cement and mortar on site, but the ground is leveled by steel strip keels or point keels, but there is still a high ground thickness (if paved The plumbing layer leads to the problem that the thickness of the ground exceeds 10cm). At the same time, due to the overhead of the steel strip keel or point keel, when the user wears high heels, leather shoes, moves furniture and drops things, it is easy to generate ground echoes and affect the building. Neighbors make an impact

Method used

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  • Floor installing structure and installing method

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Embodiment Construction

[0037] It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0038] Before discussing the exemplary embodiments in more detail, it should be mentioned that some exemplary embodiments are

[0039] Specific structural and functional details disclosed herein are representative only and for purposes of describing example embodiments of the present invention. This invention may, however, be embodied in many alternative forms and should not be construed as limited to only the embodiments set forth herein.

[0040] It will be understood that although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, withou...

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PUM

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Abstract

The invention relates to a floor installing structure and an installing method. The floor installing structure comprises a floor base material layer; an underfloor heating sound insulation assembly, wherein the underfloor heating sound insulation assembly is provided with multiple leveling through holes; and multiple leveling structural components for leveling the installed floor base material layer, wherein the multiple leveling structural components are installed in the leveling through holes. The underfloor heating sound insulation assembly and the leveling structural components are clampedand installed between the floor base material layer and a building foundation surface. Through modularizing the underfloor heating sound insulation assembly, and fixing the underfloor heating sound insulation assembly and the leveling structural components between the floor base material layer and the building foundation surface, a thickness of a floor is reduced after the floor is installed completely. Because the underfloor heating sound insulation assembly and the leveling structural components are directly fixed between the floor base material layer and the building foundation surface, anaerial structure between the floor base material layer and the building foundation surface is eliminated, so a downstair neighbor is effectively avoided from being affected by activity of the floor.

Description

technical field [0001] The application relates to a ground installation structure and an installation method. Background technique [0002] In the traditional ground installation (home improvement) process, ground leveling is a necessary process, such as figure 1 As shown, the home improvement workers first lay the circuit pipeline including the electric pipe and the floor heating insulation layer on the building foundation, cover the cement mortar layer for leveling, and then lay the plumbing pipe cushion including the floor heating coil, and then use cement mortar Filling is carried out, and then the decorative surface (wooden floor, tile or stone) is installed. [0003] Because this traditional ground installation construction process is very time-consuming, and the required drying cycle is also long. In addition, in the installation process of the final decorative surface layer, the requirements for the personal experience and skills of the workers are very high, and th...

Claims

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Application Information

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IPC IPC(8): E04F15/02E04F15/024
CPCE04F15/02044E04F15/02452E04F15/02494
Inventor 郭辉张轶然王子诚祁高铭
Owner 变形积木(北京)科技有限公司