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An Experimental Device for Quickly Measuring Contact Thermal Resistance

A technology of contact thermal resistance and experimental equipment, applied in the direction of material thermal development, etc., can solve problems such as contact thermal resistance data deviation, achieve temperature stability, and avoid the effect of vacuuming time

Active Publication Date: 2021-11-16
XIAN INSTITUE OF SPACE RADIO TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since different materials and contact states have a great influence on the contact thermal resistance, if the actual working conditions of the solid contact surface cannot be accurately simulated, the contact thermal resistance data may have a large deviation

Method used

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  • An Experimental Device for Quickly Measuring Contact Thermal Resistance
  • An Experimental Device for Quickly Measuring Contact Thermal Resistance
  • An Experimental Device for Quickly Measuring Contact Thermal Resistance

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Experimental program
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Embodiment Construction

[0038] Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:

[0039] The invention provides an experimental device for quickly measuring the contact thermal resistance, which realizes the measurement of the contact thermal resistance of different material contact surfaces or different surface treatments of the same material through one device.

[0040] Measurement scheme design

[0041] The principle of contact thermal resistance measurement is as follows: when two solid specimens are in contact with each other under a certain pressure and there is heat transfer, since the specimens are under vacuum conditions, there is no convective heat transfer and little radiation heat transfer, so it is approximately considered All the heat generated by the heater passes through the contact interface and is transmitted along the axial direction of the specimen. Although in the area near the contact surface, due to the...

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Abstract

An experimental device for quickly measuring contact thermal resistance, which relates to the field of contact thermal resistance testing between solids; including a cold source TEC, a chassis, a handle, a lower test piece, an upper test piece, a heat source heating sheet, a pressure sensor, and a support sleeve , support rods, support sheets and connecting rods; the chassis is placed horizontally on the upper surface of the cold source TEC; the handle is set at the edge of the upper surface of the chassis; the lower specimen is fixedly installed at the center of the upper surface of the chassis; The top of the test piece; the heat source heating plate is set on the top of the upper test piece; the pressure sensor is set on the top of the heat source heating plate; the support sleeve is set on the top of the pressure sensor; the support plate is set on the outer wall of the fixed end of the support sleeve; the side of the support plate The side is fixedly connected with the chassis through the support rod; the connecting rod passes through the support plate and the support sleeve in turn, and contacts with the upper surface of the pressure sensor; the invention realizes the measurement of the contact surface of different materials or the contact of the same material with different surface treatments through one device thermal resistance.

Description

technical field [0001] The invention relates to the field of testing contact thermal resistance between solids, in particular to an experimental device for rapidly measuring contact thermal resistance. Background technique [0002] Aerospace electronic products have to experience harsh thermal environments during their development and flight. In order to ensure that the products can work normally, it is necessary to control the heat transfer process of electronic products from components to heat sinks. Heat conduction is the most important heat transfer method for aerospace electronic products in the cabin. The conduction thermal resistance is mainly composed of the thermal conduction resistance inside the solid and the contact thermal resistance between the solid interfaces. When different products or different parts of the same product are in contact with each other, contact thermal resistance will be generated. Contact thermal resistance is an important parameter to deter...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N25/20
CPCG01N25/20
Inventor 王升胡凤姣李红然张立汪新刚郑丕涛董锋曹健
Owner XIAN INSTITUE OF SPACE RADIO TECH