Electronic product encapsulation device and method

An electronic product and potting technology, which is applied to the device for coating liquid on the surface, pretreatment surface, coating, etc., can solve problems such as excess and damaged products, affect product performance, and unsafety, and reduce material consumption , Reduce the cost of raw materials, the effect of low density

Inactive Publication Date: 2019-04-09
GUIZHOU AEROSPACE ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When encapsulating circuit boards as a whole, at present, polyurethane, silicone rubber or epoxy resin is basically used for potting. However, due to the good fluidity of the rubber and improper plugging measures, the rubber often flows to The part of the circuit board that does not need to be potted will affect the performance of the product, and it will take a lot of time to remove the excess glue after curing, which is very easy to produce excess and damage the product, which is cumbersome and unsafe

Method used

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  • Electronic product encapsulation device and method
  • Electronic product encapsulation device and method

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Embodiment Construction

[0034] The technical solution of the present invention is further described below, but the scope of protection is not limited to the above.

[0035] Such as Figure 2 to Figure 5 A potting device for electronic products includes a plugging tool 6; the plugging tool 6 is a flange structure, the circuit board 2 is placed and fixed in the box body 1, the circuit board 2 has a through cavity 3 in the middle position, and the box body 1 There is a recessed platform 4 on the back of the device. The main part of the plugging tool 6 is structurally matched with the through cavity 3, and the flange part is structurally matched with the recessed platform 4.

[0036] A sealing ring 7 is also included, and the sealing ring 7 is sleeved on the main body part of the leak plugging tool 6 to closely adhere to the flange part.

[0037] The inner edge size of the sealing ring 7 matches the external size of the main part of the leak plugging tool 6, and the outer edge size of the sealing ring 7 is sma...

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Abstract

The invention provides an electronic product encapsulation device. The encapsulation device comprises a plugging tool, and the plugging tool is of a flange structure. A circuit board is fixedly arranged in a box body, a through cavity is formed in the middle of the circuit board, and a concave platform is arranged on the back face of the box body. The main body part of the plugging tool is matchedwith the through cavity structure, and the flange part is matched with the concave platform structure. According to the electronic product encapsulation device , the process time is short, the reliability of the circuit board and the device is improved, the production efficiency is improved, the cost is reduced, and the filling performance and the safety of product are improved.

Description

Technical field [0001] The invention relates to a potting device and method for electronic products. Background technique [0002] At present, the vast majority of electronic products are modular products in which the circuit board is installed in the box and then packaged. In order to ensure the normal operation of the electronic product and prevent damage to the circuit board and components or connection failure due to shock and vibration, it is now universal The method is to encapsulate the circuit board as a whole in the box to achieve reinforcement. [0003] When the circuit board is potted as a whole, rubber materials such as polyurethane, silicon rubber or epoxy resin are basically used for potting. However, due to the good fluidity of the rubber material and improper leak plugging measures, the rubber material will often flow to The circuit board does not need to be potted and affects the product performance, and after curing, it will take a lot of time to remove the exces...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C5/00B05C13/02B05D1/26B05D3/02
CPCB05C5/002B05C13/02B05D1/26B05D3/0263
Inventor 潘静
Owner GUIZHOU AEROSPACE ELECTRONICS TECH CO LTD
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