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Multi-carrier-disc wafer transfer equipment and system

A technology for conveying equipment and wafers, applied in metal processing equipment, grinding/polishing equipment, grinding machines, etc., can solve the problems of low transmission efficiency, limited transmission flexibility, easy to bring contamination, etc., to achieve efficient transmission Effect

Active Publication Date: 2019-04-09
BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a multi-carrier wafer transfer equipment to solve the problem of using the rotation of the polishing head and the linear movement of the carrier to carry out wafer transfer. Limited flexibility and low transmission efficiency

Method used

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  • Multi-carrier-disc wafer transfer equipment and system
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  • Multi-carrier-disc wafer transfer equipment and system

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Embodiment Construction

[0063] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

[0064] Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art wi...

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Abstract

The invention relates to the field of wafer processing, and provides multi-carrier-disc wafer transfer equipment and system for solving the problems that by adopting polishing head rotation and carrier table linear movement for wafer conveying, wafers are prone to being contaminated due to process switching between different polishing tables, the conveying flexibility is limited by linear movementdesign, and the conveying efficiency is low. According to the multi-carrier-disc wafer transfer equipment, a drive control mechanism can drive and control a circular track to sequentially transfer and stop all wafer carrier discs charged at a cleaning station to one of polishing stations, and discharging and charging are completed at the polishing stations; and the drive control mechanism can also drive and control the circular track to transfer and stop all the wafer carrier discs charged at the polishing stations to the cleaning station, and discharging is completed. Through the transmission mode, multi-step complex processes can be achieved, and the effects that each wafer is independently polished at the corresponding polishing station and efficiently transferred between different transfer stations are achieved. The multi-carrier-disc wafer transfer system comprises the multi-carrier-disc wafer transfer equipment.

Description

technical field [0001] The invention relates to the field of wafer processing, in particular to multi-carrier wafer transfer equipment and a transfer system. Background technique [0002] At present, the transmission mode and disadvantages of wafers between different transfer stations: [0003] 1. Use the polishing head to rotate for wafer transmission. The transmission and the process are bound together, resulting in a many-to-many working mode between the polishing head and the worktable. The disadvantage is that the process conversion between different polishing tables is easy to cause contamination, and the differences between the polishing heads will eventually be reflected in the Wafer planarization effect on. [0004] 2. Carry out wafer transfer through the linear movement of the stage. The design of linear movement limits the flexibility of the transmission. In addition, the design is not easy to maintain and has a high error rate. Contents of the invention [...

Claims

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Application Information

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IPC IPC(8): B24B29/02B24B27/00B24B41/00B24B41/06B24B41/02
CPCB24B27/0023B24B27/0069B24B29/02B24B41/005B24B41/02B24B41/06
Inventor 李婷尹影贾若雨姚远费玖海
Owner BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC
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