A reflective circuit board and its manufacturing method

A manufacturing method and circuit board technology, which is applied in printed circuit manufacturing, printed circuit, circuit layout, etc., can solve the problems of low reflectivity of white paint and low efficiency of backlight of mini-LED chips, so as to improve backlight efficiency and reflective effect , Improve the effect of backlight effect

Active Publication Date: 2020-09-01
HUIZHOU CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for manufacturing a reflective circuit board and a reflective circuit board to solve the technical problems of low reflectivity of white paint on the circuit board and low backlight efficiency of mini-LED chips in the prior art

Method used

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  • A reflective circuit board and its manufacturing method
  • A reflective circuit board and its manufacturing method
  • A reflective circuit board and its manufacturing method

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Embodiment Construction

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.

[0028] The terms "first", "second", "third", etc. (if any) in the description and claims of the present invention and the above drawings are used to distinguish similar objects and not necessarily to describe a specific order or sequentially. It should be understood that the items so described are interchangeable under appropriate circumstances. Furthermore, the terms "comprising" and "having", as well as any variations thereof, are intended to cover a non-exclusive in...

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Abstract

The invention provides a reflective circuit board and a manufacturing method thereof. The manufacturing method of the reflective circuit board comprises the following steps: a preparation step of a circuit board, a photoresist coating step, a photoresist curing step, a first photoresist removal step, a silver plating step, a preparation step of a protective layer and a second photoresist removal step; the reflective circuit board comprises the circuit board and a reflective layer, and the circuit board is provided with at least one LED (Light-emitting Diode) chip; and the reflective layer is adhered with an area, except for the LED chips, of the circuit board. The reflective circuit board and the manufacturing method disclosed by the invention have the technical effects that after the reflective circuit board is applied to a backlight module, a part of light, emitted by a reflective layer, of the LED chips arranged on the circuit board is reflected through a backlight membrane, then isreturned to the circuit board and cannot be absorbed by the circuit board, so that the backlight efficiency of the backlight module can be effectively improved, and the backlight effect of the backlight module is improved.

Description

technical field [0001] The invention relates to the technical field of display panels, in particular to a reflective circuit board and a manufacturing method thereof. Background technique [0002] A light-emitting diode (English: Mini Light Emitting Diode, referred to as: LED) is a semiconductor electronic component that can emit light. Chip is the most important part of LED, which is widely used in indoor and outdoor display screens. From the TV display screen at the beginning, to the computer display screen, and then to the current mobile phone display screen, the size of the display screen is gradually reduced, and the size of the LED chip used on the display screen is also reduced accordingly, so that A mini light-emitting diode (English abbreviation: Mini-LED) chip whose size reaches the micron level has been produced. In terms of manufacturing process, when coupled with flexible substrates, Mini LED chips are also suitable for notch designs and highly curved backligh...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/28F21V23/00F21Y115/10
CPCF21V23/004F21Y2115/10H05K1/0274H05K3/285
Inventor 熊充
Owner HUIZHOU CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD
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