Full-automatic semiconductor circle rolling machine

Abstract

The invention discloses a full-automatic semiconductor circle rolling machine. A base, two rough grinding assemblies, an automatic feeding and discharging device and a feeding mechanism arranged at the upper portion of the base are included. A clamping assembly is arranged at the upper portion of the feeding mechanism. Rough grinding assembly installing bases are arranged on the two sides of the middle portion of the base correspondingly. The two rough grinding assemblies are oppositely arranged and arranged on the rough grinding assembly installing bases on the two sides of the base. A size detection assembly, a V groove grinding assembly and a fine grinding assembly for conducting fine grinding or OF face grinding on bars are arranged in front of the rough grinding assemblies in the feeding direction, wherein a crystal direction detection assembly is arranged in front of the fine grinding assembly and the V groove grinding assembly in the bar feeding direction. Various assemblies, the feeding mechanism and the automatic feeding and discharging device are in communication connection with a control system. The full-automatic semiconductor circle rolling machine is high in grindingefficiency and combines the function of OF face grinding or V groove forming at the same time, and the equipment capacity is greatly improved.

Description

technical field [0001] The invention relates to the technical field of silicon rod processing equipment, in particular to a semiconductor automatic spheronizing machine. Background technique [0002] The semiconductor spheronizer is a device for rounding and grinding semiconductor silicon rods, and it is necessary to grind the OF surface or open V grooves on the silicon rods to prepare for the next process. At present, when the semiconductor spheroidizing machine equipment in the existing market in the industry is used for spheroidal grinding, one rough grinding and one fine grinding are usually set up, the grinding efficiency is low, and at the same time, the functions of OF surface grinding or V-groove opening cannot be taken into account, and the degree of automation of the equipment is relatively low. Low. In view of the above problems, the present invention is proposed. Contents of the invention [0003] The purpose of the present invention is to provide a semicondu...

AI Technical Summary

Problems solved by technology

At present, when the semiconductor spheroidizing machine equipment in the existing market in the industry is used for spheroidal grinding, one rough grinding and one fine grinding are usually set up, the grinding efficiency is low, and at the same time, the functions of OF surface grinding or V-groove opening cannot be taken into account, and the degree of automation of the equipment is relatively low. Low

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