[0021] In order to enable those skilled in the art to better understand the technical solutions in this application, the following will clearly and completely describe the technical solutions in the embodiments of this application with reference to the drawings in the embodiments of this application. Obviously, the described The embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative work should fall within the protection scope of this application.
[0022] figure 1 Shows a schematic structural diagram of a camera module in a mobile terminal in the related art, from figure 1 It can be seen that the camera module includes a circuit board 101, a photosensitive chip 102, a lens 103, and a focus motor 104. When focusing, the focus motor 104 controls the lens 103 along the optical axis of the incident light (ie figure 1 The dashed arrow in the middle) to change the distance between the lens 103 and the photosensitive chip 102 to achieve focusing; when the camera module shakes, that is, when the camera module as a whole tilts, the focus motor 104 can be used to control the lens 103 pan or tilt to compensate for the offset caused by jitter, and then achieve optical anti-shake, so that the image is clearer.
[0023] Obviously, in the structure of the above-mentioned camera module, on the one hand, the focus motor 104 is required to control the movement and/or tilt of the lens 103 to achieve focusing and optical image stabilization. Therefore, the presence of the focus motor 104 increases the camera module’s The size and weight also increase the cost of the camera module; on the other hand, since the movement and/or tilt of the lens 103 is controlled to achieve focusing and anti-shake functions, it is necessary to reserve space for the movement and/or tilt of the lens 103, This further increases the size of the camera module.
[0024] In order to solve the above-mentioned problems, an embodiment of the present application provides a camera module, such as figure 2 As shown, the camera module may include:
[0025] The photosensitive chip 102 and the lens 103 arranged on the photosensitive circuit of the photosensitive chip 102; and,
[0026] The circuit board 101 includes a hollow area 105, and the photosensitive chip 102 is arranged in the hollow area 105;
[0027] A plurality of shape memory alloy wires 106, one end of each shape memory alloy wire 106 is connected to the photosensitive chip 102, and the other end is connected to the bottom edge of the hollow area 105 of the circuit board 101;
[0028] A plurality of metal springs 107, one end of each metal spring 107 is connected to the photosensitive chip 102, and the other end is connected to the upper surface of the circuit board 101, so as to suspend the photosensitive chip 102 and realize signal transmission between the photosensitive chip 102 and the circuit board 101;
[0029] Wherein, when the current flowing through the multiple shape memory alloy wires 106 changes, the length of the multiple shape memory alloy wires 106 changes accordingly; the change in the length of the multiple shape memory alloy wires 106 can make the photosensitive chip 102 relative to the incident light in the hollow area 105 change. Optical axis (ie figure 2 The dotted arrow in the middle) changes in position and/or tilt angle.
[0030] In the embodiment of the present application, the hollow area 105 in the circuit board 101 may be manufactured by a cavity process, and the size of the hollow area 105 may be set according to the size of the photosensitive chip 102, which is not particularly limited in this exemplary embodiment. The shape of the hollow area 105 may be, for example, a rectangle, a square, a circle, etc., which is not particularly limited in this exemplary embodiment.
[0031] The specific connection mode of each shape memory alloy wire 106 to the photosensitive chip 102 and the circuit board 101 may include: one end of each shape memory alloy wire 106 is connected to the upper surface of the photosensitive chip 102, and the other end of each shape memory alloy wire 106 is connected to the circuit board The bottom edge of the hollow area 105 of 101 is connected; one end of each shape memory alloy wire 106 is connected to the bottom surface of the photosensitive chip 102, and the other end of each shape memory alloy wire 106 is connected to the bottom edge of the hollow area 105 of the circuit board 101.
[0032] It should be noted that pads can be provided on both the circuit board 101 and the photosensitive chip 102, and the width of the pads on the circuit board 101 and the photosensitive chip 102 should be greater than or equal to the width of the shape memory alloy wire 106, so that the shape memory alloy The wire 106 can be connected to the circuit board 101 and the photosensitive chip 102 by soldering with pads.
[0033] The number of the shape memory alloy wires 106 may be 2, 3, 4, 5, etc., which is not particularly limited in this exemplary embodiment. In order to ensure that the photosensitive chip 102 can be more stable in the hollow area 105 relative to the optical axis of the incident light, the position of the optical axis and/or the tilt angle is changed, and the shape memory alloy wire 106 is used with the least number to reduce the cost. The number of 106 can be four, and the connection modes of the four shape memory alloy wires 106, the photosensitive chip 102 and the circuit board 101 can include the following two:
[0034] The first type, such as image 3 As shown, if the hollow area 105 is rectangular, one end of the four shape memory alloy wires 106 is connected to the four corners of the photosensitive chip 102, and the other end of the four shape memory alloy wires 106 is connected to the hollow area 105 of the circuit board 101. The four corners of the bottom edge are connected; the second type, if the hollow area 105 is rectangular, one end of the four shape memory alloy wires 106 is connected to the four sides of the photosensitive chip 102, and the other of the four shape memory alloy wires 106 One end is respectively connected to the four sides of the bottom edge of the hollow area 105 of the circuit board 101.
[0035] Next, the properties of the shape memory alloy wire 106 will be described. When the temperature of the shape memory alloy wire 106 changes, its crystal structure also changes, which in turn changes its shape. Specifically, when the temperature of the shape memory alloy wire 106 becomes higher, the length of the shape memory alloy wire 106 becomes shorter and its cross-sectional area becomes larger. When the temperature of the shape memory alloy wire 106 becomes lower, the shape memory alloy wire 106 becomes The length becomes longer, and its cross-sectional area becomes smaller. Based on the above properties, the temperature of the shape memory alloy wire 106 can be changed by supplying current to the shape memory alloy wire 106 and the length of the shape memory alloy wire 106 can be changed by changing the magnitude of the current. It should be noted that the operating temperature range of the shape memory alloy wire 106 is 100° to 110°, and the shape of the shape memory alloy wire 106 is not affected by the external environment temperature. In addition, since the resistance of the shape memory alloy wire 106 changes when the shape of the shape memory alloy wire 106 occurs, the length of the shape memory alloy wire 106 can be obtained by measuring the resistance value of the shape memory alloy wire 106.
[0036] The type of metal shrapnel 107 can be selected by yourself, but in order to ensure the stability of the connection between the metal shrapnel 107 and the photosensitive chip 102 and the circuit board 101, a metal shrapnel 107 with better weldability can be selected, for example, copper alloy plate shrapnel or nickel-plated Stainless steel thin plate shrapnel, etc., this exemplary embodiment does not make a special limitation on this. The shape of the metal shrapnel 107 can be, for example, a strip or comb shape (such as image 3 Shown in), etc., this exemplary embodiment does not specifically limit this. It should be noted that the metal shrapnel 107 has the characteristics of shrapnel, that is, it has elasticity, and follows Hu Ke's law. Based on the above characteristics, the metal shrapnel 107 can deform according to the movement of the photosensitive chip 102. It should be noted that pads can be provided on both the circuit board 101 and the photosensitive chip 102, and the width of the pads on the circuit board 101 and the photosensitive chip 102 should be greater than or equal to the width of the metal dome 107, so that the metal dome 107 can pass It is soldered to the pad, thereby being connected to the circuit board 101 and the photosensitive chip 102.
[0037] Further, there are two ways to provide current to the shape memory alloy wire 106:
[0038] In the first type, each shape memory alloy wire 106 forms an electrical circuit with at least one metal elastic piece 107, so that the circuit board 101 provides current to each shape memory alloy wire 106.
[0039] The second type is to provide a control module in the camera module, and the control module is used to provide current to each shape memory alloy wire 106.
[0040] In order to increase the strength of the camera module, the camera module may further include a reinforcing steel sheet 108 arranged on the lower surface of the circuit board 101. Specifically, the reinforcing steel sheet 108 may be welded to the lower surface of the circuit board 101 through a welding material, and the reinforcing steel sheet 108 may also be bonded to the lower surface of the circuit board 101 through conductive glue. This exemplary embodiment is There are no special restrictions.
[0041] In the following, the process of changing the position of the photosensitive chip 102 relative to the optical axis of the incident light and/or the inclination angle of the photosensitive chip 102 in the hollow area 105 by changing the length of the plurality of shape memory alloy wires 106 by the following three methods Be explained.
[0042] Method 1: When the lengths of multiple shape memory alloy wires 106 are simultaneously extended or shortened by the same length according to the current flowing through them, the position of the photosensitive chip 102 relative to the optical axis of the incident light in the hollow area 105 can be changed to The distance between the photosensitive chip 102 and the lens 103 is changed. In the embodiment of the present application, if the focus function of objects at different distances is realized, current can be input to each shape memory alloy wire 106 at the same time according to the distance between the object and the camera module, so that each shape memory alloy wire 106 can be extended or shortened simultaneously With the same length, the position of the photosensitive chip 102 relative to the optical axis of the incident light in the hollow area 105 is changed to change the distance between the photosensitive chip 102 and the lens 103, so as to realize the focusing function of objects at different distances. E.g, Figure 4 This is a schematic diagram of a camera module provided by an embodiment of this application for focusing on objects at a close distance, from Figure 4 It can be seen that when focusing on an object 109 at a close distance, by simultaneously extending the shape memory alloy wires 106 by the same length, the position of the photosensitive chip 102 relative to the optical axis of the incident light in the hollow area 105 is controlled to change, and then The distance between the photosensitive chip 102 and the lens 103 is reduced to focus on an object 109 at a close distance. For another example, Figure 5 This is a schematic diagram of a camera module provided in an embodiment of this application for focusing on a distant object, from Figure 5 It can be seen that when focusing on a long-distance object 109, the shape memory alloy wire 106 is shortened by the same length at the same time to control the position of the photosensitive chip 102 in the hollow area 105 relative to the optical axis of the incident light to change, thereby increasing The distance between the large photosensitive chip 102 and the lens 103 is to focus on a distant object 109.
[0043] Method 2: When the lengths of multiple shape memory alloy wires 106 are simultaneously extended or shortened to different lengths according to the current flowing through them, the position of the photosensitive chip 102 relative to the optical axis of the incident light in the hollow area 105 can be generated. Changes and tilt angles change. In the embodiment of the present application, if the focusing function and the anti-shake function of objects at different distances are realized at the same time, the current can be input to each shape memory alloy wire 106 according to the distance of the object from the camera module and the tilt angle of the camera module. The shape memory alloy wires 106 are simultaneously extended or shortened by different lengths, so that the position of the photosensitive chip 102 relative to the optical axis of the incident light in the hollow area 105 is changed to change the distance between the photosensitive chip 102 and the lens 103 At the same time, the inclination angle of the photosensitive chip 102 with respect to the optical axis of the incident light is changed, so as to simultaneously complete the focusing function and the optical image stabilization function of objects at different distances.
[0044] Method 3: When the length of a part of the shape memory alloy wire 106 of the plurality of shape memory alloy wires 106 is extended or shortened according to the current flowing thereon, the photosensitive chip 102 can be positioned in the hollow area 105 relative to the optical axis of the incident light. The tilt angle changes. In the embodiment of this application, if the optical anti-shake function is implemented, that is, when hand-shake occurs in the process of taking pictures or video recording, the inclination angle of the camera module caused by the hand-shake can be applied to part of the shape memory alloy wire 106 Input current to extend or shorten part of the shape memory alloy wire 106, thereby changing the inclination angle of the photosensitive chip 102 with respect to the optical axis of the incident light, so as to correct the inclination caused by hand shaking, thereby realizing the optical image stabilization function. For example, from Image 6 It can be seen that when the camera module tilts in the counterclockwise direction due to hand shaking, the photosensitive chip 102 can be controlled to tilt in the clockwise direction in the hollow area 105 by extending or shortening part of the shape memory alloy wire 106 to compensate Tilt caused by hand shaking to achieve focus and thus achieve optical image stabilization.
[0045] It should be noted that the above three methods are only three of the multiple methods for changing the position and/or inclination angle of the photosensitive chip 102 relative to the optical axis of the incident light in the hollow region 105, that is, the above three methods are only Exemplary and not used to limit the present invention.
[0046] In summary, because the multiple shape memory alloy wires 106 are used to control the position of the photosensitive chip 102 in the hollow area 105 relative to the optical axis of the incident light to change and/or the tilt angle, the focus and optical image stabilization functions are realized, and In the related art, the focus motor 104 in the camera module is used to control the movement and/or tilt of the lens 103 to achieve focusing and optical image stabilization. Therefore, compared with the related art, the embodiment of the present application does not use the focus motor 104. The size, weight, and cost of the camera module are reduced, and the power consumption of the camera module is also reduced, thereby making the mobile terminal lighter and thinner, and also reducing the cost and power consumption of the mobile terminal; in addition, because the photosensitive chip 102 is in The position of the hollow area 105 in the circuit board 101 relative to the optical axis of the incident light changes and/or the tilt angle changes. Therefore, there is no need to reserve additional space for the lens 103 to move and/or tilt in the camera module to reduce The height of the camera module is reduced, thereby further reducing the size of the camera module.
[0047] Based on the camera module disclosed in the embodiment of the present invention, the embodiment of the present invention discloses a mobile terminal. The disclosed mobile terminal includes a housing and the camera module in the above embodiments, and the camera module is arranged in the housing.
[0048] The mobile terminal disclosed in the embodiment of the present invention may be a terminal device such as a mobile phone, a tablet computer, an e-book reader, and a game console, and the embodiment of the present invention does not limit the specific type of the mobile terminal.
[0049] The above embodiments of the present invention focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the conciseness of the text, here is No longer.
[0050] The embodiments of the present invention are described above with reference to the accompanying drawings, but the present invention is not limited to the above-mentioned specific embodiments. The above-mentioned specific embodiments are only illustrative and not restrictive. Those of ordinary skill in the art are Under the enlightenment of the present invention, many forms can be made without departing from the purpose of the present invention and the scope of protection of the claims, all of which fall within the protection of the present invention.
