The utility model belongs to the technical field of
diamond processing equipment, and particularly relates to
diamond copper material
processing equipment based on
green laser processing, which comprises a rack, a
laser system and a displacement platform are arranged on the rack, the
laser system comprises a
green laser, a reflecting mechanism and a light condensing mechanism, the rack comprises two
layers of mounting flat plates, and the mounting flat plates are arranged on the rack. A
green laser is arranged on the upper-layer mounting flat plate, a reflecting mechanism is arranged on one side of the green
laser, a
light hole is formed in the upper-layer mounting flat plate, and laser emitted by the green laser is reflected by the reflecting mechanism and then is emitted downwards from the
light hole; and a displacement platform is arranged on the lower-layer mounting flat plate and comprises an XY moving platform and a Z-axis moving platform. According to the
diamond copper material
machining equipment, the
green light (532 nm) laser is selected to
cut the diamond
copper material, and compared with a traditional
infrared light source, the diamond copper material
machining equipment is more suitable for ultra-precision micro-
nano machining of the diamond copper material.