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Phased-array ultrasonic detection method for interfacial de-bonding of composite material

A composite material and ultrasonic detection technology, applied in the direction of using sound wave/ultrasonic wave/infrasonic wave to analyze solids, etc., to achieve the effect of high detection accuracy, high resolution and strong detection ability

Inactive Publication Date: 2014-07-02
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Phased array ultrasonic testing technology has not been reported in the detection of debonding at the interface of composite materials

Method used

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  • Phased-array ultrasonic detection method for interfacial de-bonding of composite material
  • Phased-array ultrasonic detection method for interfacial de-bonding of composite material
  • Phased-array ultrasonic detection method for interfacial de-bonding of composite material

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Embodiment

[0029] Such as Figure 3a , Figure 3b , Figure 4a , Figure 4b As shown, the present invention proposes a phased array ultrasonic detection method for interfacial debonding of composite materials, which uses the synthesis and focusing of ultrasonic beams to detect composite materials, and the detection process includes the following steps:

[0030] 1. Input the sound velocity of composite material 2 and composite material 3, deflection angle of sound velocity, probe frequency, focal length, number of activated wafers, scanning type, and scanning step on the phased array ultrasonic detector through the preset software as required. parameters such as angle of entry.

[0031] 2. After completing the parameter setting, remove the dirt on the surface of the object to be detected and the moving area of ​​the probe, and apply a coupling agent on the surface of the composite material 2 and the moving area of ​​the probe. The coupling agent is machine oil.

[0032] 3. Adjust the ...

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PUM

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Abstract

The invention discloses a phased-array ultrasonic detection method for interfacial de-bonding of a composite material. The method comprises the following steps: (1) sequentially triggering each wafer of a phased-array probe to generate ultrasonic signals, superposing the ultrasonic signals, propagating the ultrasonic signals inside the composite material, and reflecting the ultrasonic signals during the interface de-bonding or interfacial de-bonding of the composite material; (2) superposing the reflected ultrasonic signals, receiving the ultrasonic signals by using the phased-array probe, performing data processing, and then outputting a phased-array scanning image through a phased-array display instrument; (3) comparing an ultrasonic detection image during the good interfacial bonding of the composite material with an ultrasonic detection image during the interfacial de-bonding of the composite material to judge whether the composite material has a de-bonding defect. The method has the advantages of high detection accuracy, simple operation process and the like.

Description

technical field [0001] The invention relates to a non-destructive detection technology for composite material interface bonding, in particular to a phased array ultrasonic detection method for composite material interface debonding defects. Background technique [0002] The use of composite materials enhances the performance of products, but at the same time creates challenges for non-destructive testing. Debonding, as one of the most important defects of multilayer bonded composite materials, directly affects the reliability of composite materials. As a means of connecting materials or structures, bonding has many advantages, such as convenient construction, dispersion of connection stress, low requirements on the bonding body itself, and wide application. Usually, the effect of bonding is determined by the bonding process, such as the composition design of the adhesive, process design, etc. Adhesive structures have been widely used in aviation, aerospace and military fie...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N29/09
Inventor 袁超谢从珍李立浧
Owner SOUTH CHINA UNIV OF TECH
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