The present invention discloses a photoelectric detection material testing
system based on a BGA packaged front-end
chip, which belongs to the technical field of photoelectric detection materials and can solve the problem of a large number of designed PCB
layers when the
system packaging density and the number of pins in the existing BGA
package are large. The
system includes: a PCB board, on which a plurality of vias are arranged; a photoelectric detection material, arranged on the first surface of the PCB board; the photoelectric detection material constitutes a plurality of independent pixels; each via corresponds to each pixel one by one; a BGA packaged front-end
chip, arranged on the second surface of the PCB board, the BGA packaged front-end
chip has a plurality of pins, each via corresponds to a pin, and the
anode of each pixel is electrically connected to the corresponding pin through the corresponding via; an FPGA development board, used for packaging and transmitting the
signal transmitted by the BGA packaged front-end chip; a display screen, used for displaying the
signal transmitted by the FPGA development board. The present invention is used for the research and development of new photoelectric detection materials.