Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A free-form surface profile tolerance evaluation method based on CMM scanning measurement

A surface profile and evaluation method technology, applied in the direction of measuring devices, special data processing applications, complex mathematical operations, etc., can solve problems such as difficult to ensure comprehensive reflection of processing information, and achieve the effects of improved efficiency, guaranteed accuracy, and high efficiency

Inactive Publication Date: 2019-04-16
TIANJIN UNIV
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the set of discrete points sampled in a point-by-point manner is predetermined and directly carried out on the actual surface according to the predicted information, it is difficult for these information to fully reflect the processing information.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A free-form surface profile tolerance evaluation method based on CMM scanning measurement
  • A free-form surface profile tolerance evaluation method based on CMM scanning measurement
  • A free-form surface profile tolerance evaluation method based on CMM scanning measurement

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0041] The present invention provides a method for evaluating the profile degree of a free-form surface based on CMM scanning measurement, specifically as follows:

[0042] 1. Obtain the deviation curve

[0043] Sampling was performed on Daisy 8106HA CMM (AC-DMIS software), MPE E ≤(1.7+L / 330)μm, MPE P ≤1.7μm, and equipped with Renishaw PH10M (SP25-2) probe, the part is an S specimen processed by the side milling of a five-axis CNC machine tool, and 10 scanning lines containing 4000 measurement points are evenly distributed along the v direction on the surface. The deviation between the measurement point and the design surface is calculated using the surface segmentation method, and...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a free-form surface profile tolerance evaluation method based on CMM scanning measurement, and the method comprises the following steps: (1) obtaining an original measurement point data set of a measured piece through a scanning type three-coordinate measuring machine, calculating the deviation between points in the original measurement point data set and the surface of a design model of the measured piece, and drawing a deviation curve; (2) decomposing the deviation curve into three parts by utilizing wavelet decomposition, and extracting key points; (3) positioning the key points by using an SQP algorithm according to the mathematical model of the contour error of the free-form surface, and optimizing six parameters in the transformation matrix T to obtain a positioning key point set; And (4) calculating a deviation between the positioning key point and the surface of the tested piece design model by using a curved surface segmentation method, and obtaining acontour error according to the maximum deviation. According to the method, key points are extracted from a deviation curve through wavelet decomposition to simplify the calculation process, then the key points are positioned through the SQP algorithm, and the deviation between the positioning key points and the surface of a model is calculated through a curved surface segmentation method.

Description

technical field [0001] The invention belongs to the field of geometric measurement of machining errors, in particular to a free-form surface profile evaluation method based on CMM scanning measurement. Background technique [0002] Free-form surfaces are widely used due to their excellent geometric features. Complex geometric features make processing and manufacturing more difficult, and at the same time, the final product surface will contain various sources of processing errors. Therefore, an accurate and effective measurement and quality assessment method is necessary. Coordinate measuring machines (CMMs) are widely used to inspect geometric dimensions. Compared with CMMs equipped with touch-trigger probes that inspect surfaces point-by-point [1], scanning CMMs greatly reduce inspection time consumption while maintaining the accuracy of contact measurements [2]. [0003] According to ISO 1101 [3], the profile error of the evaluated part should be within the minimum zone...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50G06F17/16G06F17/14G01B21/20
CPCG01B21/20G06F17/148G06F17/16G06F30/20
Inventor 何改云王宏亮桑一村庞凯瑞庞域
Owner TIANJIN UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products