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A micro-rib array heat dissipation device and method equipped with a synthetic jet actuator

A technology for synthesizing jets and heat dissipation methods, which is applied to structural parts of electrical equipment, cooling/ventilation/heating renovation, electrical components, etc., and can solve problems such as unsatisfactory heat dissipation effect, complex structure of heat dissipation device, and inability to meet heat dissipation needs. , to achieve the effect of compact structure, good heat dissipation effect and easy processing

Active Publication Date: 2020-12-08
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Under the development trend of miniaturization and high performance of electronic products, the heat flux of electronic products shows a rapid growth trend, which puts forward extremely high requirements for the thermal design of electronic products. Some traditional passive heat dissipation technologies can no longer meet the requirements. The heat dissipation needs in the case of extremely high heat flux density, and the new generation of active enhanced heat dissipation technology equipped with modern high-efficiency drive and disturbance technology has become an electronic heat dissipation technology due to its excellent heat dissipation performance and strong controllability. Research Focus in Technical Areas
However, the existing heat dissipation devices generally have a complicated structure, and the heat dissipation effect is not satisfactory.

Method used

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  • A micro-rib array heat dissipation device and method equipped with a synthetic jet actuator
  • A micro-rib array heat dissipation device and method equipped with a synthetic jet actuator
  • A micro-rib array heat dissipation device and method equipped with a synthetic jet actuator

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Embodiment Construction

[0017] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0018] Such as figure 1 As shown, a micro-rib array cooling device equipped with a synthetic jet actuator, which includes a heat sink substrate 1, a micro-rib array structure 2, a top cover plate 3, and a synthetic jet actuator 4; the heat sink substrate 1 is directly or indirectly connected to the heat source connected; the micro-rib array structure 2 is located above the heat sink substrate 1; the top cover plate 3 is located above the micro-rib array structure 2; the bottom of the synthetic jet actuator 4 is an open structure, located above the top cover plate 3 and assembled with the top cover plate 3 Synthetic jet cavity6.

[0019] Such as image 3 As shown, the heat sink substrate 1 is directly connected to the heat-generating part of the electronic device or indirectly through heat pipes and other devices, so as to receive heat from the heat-ge...

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Abstract

The invention discloses a micro-rib array heat dissipation device provided with a synthetic jet actuator and a micro-rib array heat dissipation method. According to the device, the synthetic jet actuator is mounted at the top of a micro-rib array heat sink, and micro-holes are formed in the top cover plate of the micro-rib array heat sink. In this way, during the working of the synthetic jet actuator, the fluid is periodically sucked in and sprayed out through the micro-holes, so that the synthetic jet flow is formed. The synthetic jet flow generated by the synthetic jet actuator can improve the flowing environment in a micro-rib array. Finally, the effect of enhancing the heat dissipation performance of the micro-rib array heat sink is achieved. The heat sink is compact in structure, andgood in enhanced heat dissipation effect. The influence on the pressure drop before and after the micro-rib array heat sink is small. The heat dissipation intensity of the heat sink can be regulated and controlled in real time by adjusting the input parameters of the synthetic jet actuator. A new path is provided for the heat dissipation problem and temperature control of modern high-performance electronic equipment.

Description

technical field [0001] The invention belongs to the field of heat dissipation with high heat flux density, and in particular relates to a micro-rib array heat dissipation device and method equipped with a synthetic jet exciter. Background technique [0002] Under the development trend of miniaturization and high performance of electronic products, the heat flux of electronic products shows a rapid growth trend, which puts forward extremely high requirements for the thermal design of electronic products. Some traditional passive heat dissipation technologies can no longer meet the requirements. The heat dissipation needs in the case of extremely high heat flux density, and the new generation of active enhanced heat dissipation technology equipped with modern high-efficiency drive and disturbance technology has become an electronic heat dissipation technology due to its excellent heat dissipation performance and strong controllability. Research focus in the technical field. B...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/20218
Inventor 吴昌聚邱云龙李昊歌陈伟芳
Owner ZHEJIANG UNIV
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