Device and method for wafer test temperature adjustment

A technology for temperature regulation and wafer testing, which is applied in semiconductor/solid-state device testing/measurement, electrical components, circuits, etc., can solve problems such as uneven temperature distribution of wafers, and achieve the goal of solving uneven temperature distribution and improving accuracy Effect

Pending Publication Date: 2019-04-19
BEIJING INFORMATION SCI & TECH UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of the above-mentioned status quo, the object of the present invention is to overcome the above-mentioned defects in the prior art, and provide a device and met

Method used

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  • Device and method for wafer test temperature adjustment
  • Device and method for wafer test temperature adjustment
  • Device and method for wafer test temperature adjustment

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Example Embodiment

[0025] The present invention will be described below with reference to the drawings and specific embodiments.

[0026] The invention discloses a temperature adjustment device for wafer testing, which includes:

[0027] The temperature monitoring unit is used for real-time temperature monitoring of the wafer, which is composed of multiple temperature sensors and sends the temperature monitoring data to the data processing unit;

[0028] The block heating unit is used to heat the wafer and is composed of multiple heating blocks. The number and distribution of the temperature sensors in the heating block and the temperature monitoring unit are consistent, and the heating conditions of each heating block are independently adjustable;

[0029] The cooling unit is used to cool the wafers and is composed of a cold machine, a low-temperature medium supply flow path, a low-temperature medium supply control valve, a low-temperature medium flow path, a low-temperature medium return control valve ...

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Abstract

The invention discloses a device and a method for wafer test temperature adjustment. A temperature monitoring unit monitors the temperature of a wafer in real time, and a data processing unit controlsa block heating unit and a cooling unit according to the temperature monitoring result, and changes the heating condition of each heating block through a block heating unit to achieve the temperatureadjustment of the local area of the wafer so as to solve the problem that the temperature distribution is not even when the wafer is subjected to high-low temperature test and improve the wafer testaccuracy.

Description

technical field [0001] The invention relates to the technical field of integrated circuit testing equipment, in particular to a device and method for adjusting the temperature of a wafer test. Background technique [0002] The field of integrated circuit testing equipment technology belongs to the core industry of the new generation of information technology industry and has an extremely important strategic position. Integrated circuit chips are obtained by cutting and packaging wafers, and the quality of wafers directly affects the performance of integrated circuit chips. The wafer test is to conduct power-on detection on the pad pins on each die of the wafer, and complete the electrical parameter test and logic function test. The probe station is an important device to achieve reliable contact between the probe and the pad, and plays an indispensable role in wafer testing. [0003] In order to ensure that integrated circuit products can work normally in the harsh environ...

Claims

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Application Information

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IPC IPC(8): H01L21/66
CPCH01L22/12
Inventor 刘宁苏中李擎刘洪梅迪王英剑
Owner BEIJING INFORMATION SCI & TECH UNIV
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