Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Device and method for wafer test temperature adjustment

A technology for temperature regulation and wafer testing, which is applied in semiconductor/solid-state device testing/measurement, electrical components, circuits, etc., can solve problems such as uneven temperature distribution of wafers, and achieve the goal of solving uneven temperature distribution and improving accuracy Effect

Pending Publication Date: 2019-04-19
BEIJING INFORMATION SCI & TECH UNIV
View PDF5 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned status quo, the object of the present invention is to overcome the above-mentioned defects in the prior art, and provide a device and method for adjusting the temperature of the wafer test to solve the problem of uneven wafer temperature distribution in the high and low temperature test environment of the wafer

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Device and method for wafer test temperature adjustment
  • Device and method for wafer test temperature adjustment
  • Device and method for wafer test temperature adjustment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] The present invention will be described below in conjunction with the accompanying drawings and specific embodiments.

[0026] The invention discloses a device for adjusting the temperature of a wafer test, comprising:

[0027] The temperature monitoring unit is used for real-time temperature monitoring of the wafer, consisting of multiple temperature sensors, and sending the temperature monitoring data to the data processing unit;

[0028] The block heating unit is used to heat the wafer. It is composed of multiple heating blocks. The number and distribution of the heating blocks and the temperature sensors in the temperature monitoring unit are consistent. The heating conditions of each heating block can be adjusted independently;

[0029] The cooling unit is used to cool the wafer, and consists of a cooling machine, a low-temperature medium supply flow path, a low-temperature medium supply control valve, a low-temperature medium flow path, a low-temperature medium re...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a device and a method for wafer test temperature adjustment. A temperature monitoring unit monitors the temperature of a wafer in real time, and a data processing unit controlsa block heating unit and a cooling unit according to the temperature monitoring result, and changes the heating condition of each heating block through a block heating unit to achieve the temperatureadjustment of the local area of the wafer so as to solve the problem that the temperature distribution is not even when the wafer is subjected to high-low temperature test and improve the wafer testaccuracy.

Description

technical field [0001] The invention relates to the technical field of integrated circuit testing equipment, in particular to a device and method for adjusting the temperature of a wafer test. Background technique [0002] The field of integrated circuit testing equipment technology belongs to the core industry of the new generation of information technology industry and has an extremely important strategic position. Integrated circuit chips are obtained by cutting and packaging wafers, and the quality of wafers directly affects the performance of integrated circuit chips. The wafer test is to conduct power-on detection on the pad pins on each die of the wafer, and complete the electrical parameter test and logic function test. The probe station is an important device to achieve reliable contact between the probe and the pad, and plays an indispensable role in wafer testing. [0003] In order to ensure that integrated circuit products can work normally in the harsh environ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/66
CPCH01L22/12
Inventor 刘宁苏中李擎刘洪梅迪王英剑
Owner BEIJING INFORMATION SCI & TECH UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com