Novel liquid cooling equipment case

Abstract

The invention discloses a novel liquid cooling equipment case which comprises an upper cold plate, a lower cold plate, a left side plate, a left cover plate, a right side plate, a front cover plate, aprinted back plate, and an adapter plate. The inner surfaces of the upper and lower cold plates are equipped with plug-in guide rails. The outer surfaces of the upper and lower cold plates are equipped with cooling flow passages. The novel liquid cooling equipment case further includes a liquid cooling inlet pipe and a liquid cooling outlet pipe. The liquid cold inlet pipe and the liquid coolingoutlet pipe are in sealed connection with the inlet ends of the cooling flow passages of the upper cold plate and the lower cold plate respectively. The liquid cooling inlet pipe and the liquid cooling outlet pipe are installed outside the left side plate. The left side plate is configured to spatially isolate the liquid cooling inlet pipe and liquid cooling outlet pipe from the plug-in guide rails for mounting a plug-in module. The novel liquid cooling equipment case is flexible and compact in structural form, is improved in the rigidity, environmental adaptability and heat dissipation performance, has good economical efficiency and a water and electricity separation function, reduces the risk of liquid leakage, and has an expanded application range.

Description

technical field [0001] The invention relates to the field of military airborne electronic equipment, in particular to a novel horizontal liquid-cooled chassis. Background technique [0002] With the development of microelectronics technology, airborne electronic equipment continues to develop in the direction of miniaturization, integration, and modularization, resulting in prominent heat dissipation problems. Studies have shown that more than 55% of electronic equipment failure forms are caused by excessive temperature. At present, most airborne chassis adopt forced air cooling to dissipate heat. Obviously, this method can no longer satisfy high heat density modules. Since liquid cooling is 100 to 2000 times more efficient than air cooling, liquid cooling has a great impact on electronic devices. The thermal management has a unique advantage. Therefore, vehicle-mounted radars gradually adopt liquid-cooled chassis. Through the cold plate structure, the heat inside the chas...

AI Technical Summary

Problems solved by technology

[0004] In the prior art, the patent publication number: CN203812163U's Chinese utility model patent application discloses an ATR liquid-cooled reinforced computer case, and the case has announced a technical solution: a cooling channel is provided in the frame of the case, and the cooling channel is Sealed pipes, it can be seen that the cooling flow channel in the water circulation mechanism of the case is set inside the case, and the water and electricity separation design that completely separates the water circulation mechanism from the inside of the case cannot be realized. Once the cooling flow channel leaks, it will not only affect the normal operation of electronic equipment. Work, but also bring some security risks

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