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Flexible circuit board and manufacturing method of flexible circuit board

A flexible circuit board and manufacturing method technology, which can be used in printed circuit manufacturing, circuit bendable/stretchable parts, printed circuits, etc.

Active Publication Date: 2021-08-20
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during the copper plating process, it is easy to produce empty packets in the through holes, and the empty packets will cause board explosion in the subsequent baking process, thereby reducing the production yield of flexible circuit boards

Method used

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  • Flexible circuit board and manufacturing method of flexible circuit board
  • Flexible circuit board and manufacturing method of flexible circuit board
  • Flexible circuit board and manufacturing method of flexible circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0058] see Figure 1-10 , the first preferred embodiment of the present invention provides a method for manufacturing a flexible circuit board 100, including the following steps:

[0059] Step S11, see figure 1 , providing a copper clad substrate 10a. The copper clad substrate 10a includes an insulating base layer 11 and two first copper foil layers 12a formed on two opposite surfaces of the base layer 11 .

[0060] Wherein, the material of the base layer 11 can be selected from polyimide (polyimide, PI), polyethylene terephthalate (Polyethylene Terephthalate, PET) and polyethylene naphthalate (Polyethylene Naphthalate, PEN) One of a kind.

[0061] Step S12, see figure 2 At least one first opening 20 is opened in the copper-clad substrate 10a, and each first opening 20 penetrates through the base layer 11 and each first copper foil layer 12a.

[0062] Wherein, the first opening 20 is formed by laser drilling.

[0063] Step S13, see image 3 , filling conductive paste in ...

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PUM

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Abstract

A flexible circuit board, comprising an insulating base layer and two first conductive circuit layers formed on two opposite surfaces of the base layer, at least one first opening passing through the base layer, each first opening A conductive paste portion is formed, each conductive paste portion includes a first end portion and a second end portion disposed oppositely, at least the first end portion protrudes from the base layer and is exposed to the first conductive circuit layer, each The surface of the first conductive circuit layer away from the base layer is covered with an insulating layer and a second conductive circuit layer in turn, and each insulating layer is provided with at least one second opening at a position corresponding to the conductive paste part, located at the first The second opening on one side of the end extends to the first end to form a depression at the first end, and a conductive part is formed in each second opening and the depression, and the conductive part is connected to the first end. The conductive paste part is electrically connected.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a flexible circuit board and a method for manufacturing the flexible circuit board. Background technique [0002] For a double-sided flexible circuit board, it is usually necessary to open butt-connected through holes in the circuit substrates on both sides, and then plate copper in the through holes to form a conductive part electrically connecting the conductive lines on both sides. However, during the copper plating process, it is easy to generate empty packets in the through holes, and the empty packets will cause board explosion during the subsequent baking process, thereby reducing the production yield of the flexible circuit board. Contents of the invention [0003] Therefore, it is necessary to provide a flexible circuit board and a manufacturing method thereof, so as to solve the above problems. [0004] A method for manufacturing a flexible circuit board, comp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/42H05K1/11
CPCH05K1/115H05K1/118H05K3/429H05K2201/09563H05K3/4069H05K3/4644H05K3/4652H05K3/4679H05K2201/0154Y10T29/49155Y10T29/49165H05K3/4691H05K1/0353H05K1/0278H05K1/0393H05K3/0032H05K3/0064H05K3/4038
Inventor 叶子建
Owner AVARY HLDG (SHENZHEN) CO LTD