Electronic device and temperature regulation system

A technology for electronic equipment and temperature regulation, which is applied to the structural parts of electrical equipment, electrical components, cooling/ventilation/heating renovation, etc.

Inactive Publication Date: 2019-04-23
LENOVO (BEIJING) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the servers of electronic equipment generally use fans for air cooling or cooling water for water cooling, and these two heat dissipation methods are to dissipate heat to the space where the server is located, such as in the cockpit of a vehicle or inside a house. When people are in this more thermal space, they will feel uncomfortable due to the higher temperature
Even if the air conditioner is used to exchange heat in this space, the heat cannot be dissipated to the outside of the space in a timely and sufficient manner, and the heat exchange efficiency is low. Not only does the effect of improving the comfort level not obvious, but also the heat dissipation effect of the server is not ideal.

Method used

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  • Electronic device and temperature regulation system

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Embodiment Construction

[0036] The present application provides an electronic device whose heat dissipation effect is significantly improved by improving the heat dissipation method.

[0037] The present application also provides a temperature adjustment system, which can also perform heat dissipation on other equipment while realizing heat exchange between the inside and outside of the loading device.

[0038] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0039] Such as figure 1As shown, the electronic equipment provided by the embodiment of the present ap...

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PUM

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Abstract

The invention discloses an electronic device. The electronic device capable of being arranged on a movable or stationary loading device comprises a heating element, a heat exchange system and a communication pipeline,wherein according to the heating system, heat exchange of the heating element is realized through circular flowing of heat exchange liquid; the communication pipeline is used for communicating circulating pipelines of the heat exchange system and a heat exchange device, so as to realize heat exchange between coolants and the heat exchange liquid when the coolants circularly flow in passages formed by communication between the communication pipeline and the circulating pipelines. The electronic device has the advantages that liquid cooling dissipation of heat is realized through heat exchange between the coolants and the heat exchange system, and the heat is dissipated to the outside of the loading device through the circular flowing of the coolants in the circulating pipelines, so that the heat dissipation efficiency is improved, dissipation of the heat in the loading device is avoided, and the comfort level of persons is improved. The invention further provides a temperature regulation system; the temperature regulation system can realize heat exchange between the inside and the outside of the loading device and have a heat dissipation effect on the heat exchangesystem, thereby having more functions.

Description

technical field [0001] The present application relates to the technical field of electronic equipment, in particular to an electronic equipment, and also relates to a temperature adjustment system. Background technique [0002] At present, the servers of electronic equipment generally use fans for air cooling or cooling water for water cooling, and these two heat dissipation methods are to dissipate heat to the space where the server is located, such as in the cockpit of a vehicle or inside a house. When people are in this heat-rich space, they will feel uncomfortable due to the higher temperature. Even if the air conditioner is used to exchange heat in this space, the heat cannot be dissipated to the outside of the space in a timely and sufficient manner, and the heat exchange efficiency is low. Not only does the effect of improving the comfort level not obvious, but also the heat dissipation effect of the server is not ideal. Contents of the invention [0003] In view o...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20263H05K7/20272
Inventor 田婷
Owner LENOVO (BEIJING) CO LTD
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