Finishing-free composite binding agent ultrahard grinding wheel for silicon ingot grinding and preparation method and application of finishing-free composite binding agent ultrahard grinding wheel

Abstract

The invention relates to a finishing-free composite binding agent ultrahard grinding wheel for silicon ingot grinding and a preparation method and application of the finishing-free composite binding agent ultrahard grinding wheel. The finishing-free composite binding agent ultrahard grinding wheel is prepared from following raw materials in percent by weight: 8-14% of monocrystal diamond, 35-68% of bronze powder with the Sn content not smaller than 15%, 6-10% of silver powder, 1.5-8% of high-temperature-resistant resin, 2-10% of filler, 3-8% of hollow microspheres containing surface metal coatings, 0.5-2% of hexagonal boron nitride and 0.25-1.5% of a wetting agent. The finishing-free composite binding agent ultrahard grinding wheel for silicon ingot grinding has excellent self-sharpening performance in the grinding process, under the condition that the requirements of the surfaces of silicon ingots are met, the one-time cutting depth is larger than 0.5 mm, the polishing feeding speed is larger than or equal to 500 mm/min, the service life (represented by the machining length) of the grinding wheel is larger than or equal to 2,000 m, and the grinding wheel does not need to be finished in the using process.

Description

technical field [0001] The invention belongs to the field of superabrasive tools, and in particular relates to a dressing-free composite bond superhard grinding wheel for silicon ingot grinding and a preparation method and application thereof. Background technique [0002] With the vigorous development of new energy, photovoltaics has become one of the main directions for the development of new energy in the future due to its advantages of cleanness, regeneration, and no geographical restrictions. Grinding of silicon ingots is a key link in the production of silicon cells, which has high requirements for high-efficiency and high-surface-quality processing of grinding wheels. [0003] Publication number is that the Chinese patent application of CN101412207A discloses a kind of diamond grinding wheel, and its abrasive layer is made of phenolic resin, diamond, Fe 2 o 3 , CeO 2 、Al 2 o 3 , copper powder, and pore-forming agent are made according to a certain ratio, and the ...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a dressing-free composite bond superhard grinding wheel for silicon ingot grinding, so as to solve the problem that the existing grinding wheel cannot meet the technological requirements of large depth of cut and fast feed when grinding silicon materials

[0007] The second object of the present invention is to provide a method for preparing a dressing-free composite bond superhard grinding wheel for silicon ingot grinding, so as to solve the problem that the existing grinding wheel cannot meet the requirements of large depth of cut and fast feed when grinding silicon materials. process requirements

[0008] The third object of the present invention is to provide the application of the above-mentioned non-dressing composite bond superhard grinding wheel for grinding silicon ingots in silicon material grinding, so as to solve the problem that the existing grinding wheel cannot realize the large depth of cut and fast speed of silicon material grinding. feeding problem

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