Metallic bond, diamond grinding wheel prepared through bond and preparation method of diamond grinding wheel
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- BEIJING GANG YAN DIAMOND PROD CO
- Publication Date
- 2017-06-20
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Abstract
Description
technical field
[0001] The invention relates to a metal bond diamond grinding wheel and a manufacturing method thereof, in particular to a metal bond, a cutter head of a diamond grinding wheel containing the bond, a grinding wheel and a manufacturing method thereof, belonging to the technical field of diamond grinding wheels. This grinding wheel is especially suitable for thinning sapphire wafers. Background technique
[0002] The composition of sapphire is Al 2 o 3 , the Mohs hardness is 9, second only to the hardness of diamond, and is widely used in the substrate of LED light-emitting components. The current LED industry is booming. With the continuous maturity of sapphire production technology, LED lighting may replace most of the current incandescent lamps and energy-saving lamps. In addition, the display screens of mobile phones and TVs are gradually developing in the direction of LED; Sapphire has been used in high-end watch cases, optical lenses, etc. for decades....