Metallic bond, diamond grinding wheel prepared through bond and preparation method of diamond grinding wheel

A metal bond, diamond grinding wheel technology, applied in the field of diamond grinding wheels, can solve the problems of low grinding efficiency, insufficient diamond holding force, short service life, etc.

Active Publication Date: 2017-06-20
BEIJING GANG YAN DIAMOND PROD CO +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, diamond grinding wheels with vitrified bonds are widely used. Compared with metal bonded grinding wheels, the carcass is more brittle, consumes f

Method used

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  • Metallic bond, diamond grinding wheel prepared through bond and preparation method of diamond grinding wheel
  • Metallic bond, diamond grinding wheel prepared through bond and preparation method of diamond grinding wheel
  • Metallic bond, diamond grinding wheel prepared through bond and preparation method of diamond grinding wheel

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0048] Example 1

[0049] The composition and ratio of the metal bond used in this embodiment are as follows: copper-tin pre-alloyed powder (CuSn40, in which the weight percentage of Sn is 40wt%, the rest is Cu) with a particle size of 20-50μm, 96.5wt%, Graphite powder with diameter of 20-70μm 3wt%, nano α-Al 2 O 3 0.5wt%.

[0050] (1) Ingredients and mixture: According to the above weight percentage, take 96.5% of copper-tin pre-alloyed powder (CuSn40, where the weight percentage of Sn is 40%, and the rest is Cu) with a particle size of 20-50μm, and the 3% particle size is 20 -70μm graphite powder, and 0.5% nano α-Al 2 O 3 Mix together, pass through an 80-mesh sieve, take out the sieve, add CuSn40, graphite powder and nano-α-Al 2 O 3 The total mass of 2% glycerol alcohol solution (glycerol to alcohol ratio is 1:4), and put it in the three-dimensional mixer for mixing for 1 hour. Then, diamond with a concentration of 50% (prepared at a concentration of 400%) with a particle size ...

Example Embodiment

[0056] Example 2

[0057] The composition and ratio of the metal bond used in this embodiment are as follows: copper-tin pre-alloyed powder (CuSn45, in which the weight percentage of Sn is 45%, and the rest is Cu) with a particle size of 20-50μm, 98wt%, particle size 1wt% of 20-70μm graphite powder, nano α-Al 2 O 3 1wt%.

[0058] (1) Ingredients and mixture: According to the above weight percentage, take 98% of the copper-tin pre-alloyed powder (CuSn45, in which the weight percentage of Sn is 45%, the rest is Cu) with a particle size of 20-50μm, and the 1% particle size is 20 -70μm graphite powder, and 1% nano α-Al 2 O 3 Mix together, pass through an 80-mesh sieve, take out the sieve, add CuSn40, graphite powder and nano-α-Al 2 O 3 The total mass of 2% glycerol alcohol solution (glycerol to alcohol ratio is 1:4), and put it in the three-dimensional mixer for mixing for 1 hour. Then, diamonds with a concentration of 45% (prepared at a concentration of 400%) with a particle size of...

Example Embodiment

[0064] Example 3

[0065] The composition and ratio of the metal bond used in this embodiment are as follows: copper-tin pre-alloyed powder (CuSn50, in which the weight percentage of Sn is 50%, and the rest is Cu) with a particle size of 20-50μm, 97.5wt%, 0.5wt% of graphite powder with a diameter of 20-70μm and 2wt% of nano-α-Al2O3.

[0066] (1) Ingredients and mixture: According to the above weight percentage, take 97.5% of the copper-tin pre-alloy powder (CuSn50, where the weight percentage of Sn is 50%, and the rest is Cu) with a particle size of 20-50μm, and 0.5% of the particle size is 20 -70μm graphite powder, and 2% nano α-Al 2 O 3 Mix together, pass through an 80-mesh sieve, take out the sieve, add CuSn40, graphite powder and nano-α-Al 2 O 3 The total mass of 2% glycerol alcohol solution (glycerol to alcohol ratio is 1:4), and put it in the three-dimensional mixer for mixing for 1 hour. Then, diamonds with a concentration of 40% (prepared at a concentration of 400%) and a ...

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Abstract

The invention relates to a metallic bond, a diamond grinding wheel prepared through the bond and a preparation method of the diamond grinding wheel. The metallic bond comprises, by weight percent, 95%-99% of copper-tin prealloyed powder, 0.5%-3% of graphite powder and 0.5%-2% of nanometer alpha-Al2O3. The copper-tin prealloyed powder, the graphite powder, the nanometer alpha-Al2O3 and diamond are taken according to a certain proportion, procedures of burdening and material mixing, pelletizing, compression, sintering and aftertreatment are carried out in sequence, and tool bits can be prepared. The multiple tool bits are arranged on a matrix at equal distance in the circumferential direction, the cambered surfaces of the tool bits are perpendicular to the matrix, and the diamond grinding wheel is prepared. The above tool bits are uniform in ingredient and good in density, diamond distribution is uniform, and the control effect of the metallic bond on the diamond is good. The grinding wheel has the beneficial effects of being good in ground workpiece surface quality, free of dark cracks and scratches, sharp in grinding and long in service life, facilitating large-scale production and the like and is especially suitable for producing sapphire wafers with the thinning thickness ranging from 100 micrometers to 700 micrometers.

Description

technical field [0001] The invention relates to a metal bond diamond grinding wheel and a manufacturing method thereof, in particular to a metal bond, a cutter head of a diamond grinding wheel containing the bond, a grinding wheel and a manufacturing method thereof, belonging to the technical field of diamond grinding wheels. This grinding wheel is especially suitable for thinning sapphire wafers. Background technique [0002] The composition of sapphire is Al 2 o 3 , the Mohs hardness is 9, second only to the hardness of diamond, and is widely used in the substrate of LED light-emitting components. The current LED industry is booming. With the continuous maturity of sapphire production technology, LED lighting may replace most of the current incandescent lamps and energy-saving lamps. In addition, the display screens of mobile phones and TVs are gradually developing in the direction of LED; Sapphire has been used in high-end watch cases, optical lenses, etc. for decades....

Claims

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Application Information

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IPC IPC(8): B24D3/10B24D3/34
CPCB24D3/10B24D3/342
Inventor 申宁宁刘一波曹彩婷刘伟徐良黄盛林尹翔葛科
Owner BEIJING GANG YAN DIAMOND PROD CO
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