Metallic bond, diamond grinding wheel prepared through bond and preparation method of diamond grinding wheel

A metal bond, diamond grinding wheel technology, applied in the field of diamond grinding wheels, can solve the problems of low grinding efficiency, insufficient diamond holding force, short service life, etc.
CN106863152AActive Publication Date: 2017-06-20BEIJING GANG YAN DIAMOND PROD CO +1

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
BEIJING GANG YAN DIAMOND PROD CO
Publication Date
2017-06-20

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Abstract

The invention relates to a metallic bond, a diamond grinding wheel prepared through the bond and a preparation method of the diamond grinding wheel. The metallic bond comprises, by weight percent, 95%-99% of copper-tin prealloyed powder, 0.5%-3% of graphite powder and 0.5%-2% of nanometer alpha-Al2O3. The copper-tin prealloyed powder, the graphite powder, the nanometer alpha-Al2O3 and diamond are taken according to a certain proportion, procedures of burdening and material mixing, pelletizing, compression, sintering and aftertreatment are carried out in sequence, and tool bits can be prepared. The multiple tool bits are arranged on a matrix at equal distance in the circumferential direction, the cambered surfaces of the tool bits are perpendicular to the matrix, and the diamond grinding wheel is prepared. The above tool bits are uniform in ingredient and good in density, diamond distribution is uniform, and the control effect of the metallic bond on the diamond is good. The grinding wheel has the beneficial effects of being good in ground workpiece surface quality, free of dark cracks and scratches, sharp in grinding and long in service life, facilitating large-scale production and the like and is especially suitable for producing sapphire wafers with the thinning thickness ranging from 100 micrometers to 700 micrometers.
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Description

technical field

[0001] The invention relates to a metal bond diamond grinding wheel and a manufacturing method thereof, in particular to a metal bond, a cutter head of a diamond grinding wheel containing the bond, a grinding wheel and a manufacturing method thereof, belonging to the technical field of diamond grinding wheels. This grinding wheel is especially suitable for thinning sapphire wafers. Background technique

[0002] The composition of sapphire is Al 2 o 3 , the Mohs hardness is 9, second only to the hardness of diamond, and is widely used in the substrate of LED light-emitting components. The current LED industry is booming. With the continuous maturity of sapphire production technology, LED lighting may replace most of the current incandescent lamps and energy-saving lamps. In addition, the display screens of mobile phones and TVs are gradually developing in the direction of LED; Sapphire has been used in high-end watch cases, optical lenses, etc. for decades....

Claims

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