Diamond grinding wheel for metal binding agent

A diamond grinding wheel, metal bond technology, applied in metal processing equipment, abrasives, manufacturing tools, etc., can solve the problems of metal bond abrasive limitations, the surface of the workpiece is easily burned, and the surface of the abrasive tool is easy to be blocked, etc. Abrasive consumption, improved polishing performance, effect of increased impact resistance

Active Publication Date: 2017-07-28
HENAN UNIVERSITY OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, metal bond abrasives have disadvantages such as poor self-sharpening and easy clogging of the abrasive surface.
Therefore, in the grinding process, there will be problems such as the surfac

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] a. Moisten the diamond with liquid paraffin, add metal powder, copper-cerium alloy, TS-1 titanium-silicon molecular sieve, mix in a high-energy mixer for 20 hours, and fully mix; each raw material is respectively 46% Fe, 30% by weight %Cu, 5%Sn, 6%Cu-Ce, 2%Ni, 3%TS-1 titanium-silicon molecular sieve, 1% pore forming agent, 7% diamond composite abrasive grains; the TS-1 titanium-silicon molecular sieve is as follows Methods: Immerse 200-300nm TS-1 titanium-silicon molecular sieve in 5% cerium nitrate solution in acetone for 5 hours, filter, and slowly heat up and dry at a drying speed of 20°C / h, rising to 600°C and keeping warm 1h;

[0020] b. Vacuum hot pressing process is adopted, the sintering temperature is 620°C, the sintering pressure is 23 MPa, and the holding time is 12 minutes.

Embodiment 2

[0022] a. Wet the diamond with liquid paraffin, add metal powder, copper-cerium alloy, TS-1 titanium-silicon molecular sieve, mix in a high-energy mixer for 20 hours, and mix well; the raw materials are respectively 45.49% Fe, 34.55 % by weight %Cu, 6.83%Sn, 1.89%Cu-Ce, 1.41%Ni, 3%TS-1 titanium-silicon molecular sieve, 1.12% pore forming agent, 5.71% diamond composite abrasive grains; the TS-1 titanium-silicon molecular sieve is as follows Methods: Immerse 200-300nm TS-1 titanium-silicon molecular sieve into 10% cerium nitrate solution in acetone for 2 hours, filter, slowly heat up and dry at a drying speed of 20°C / h, rise to 600°C, and keep warm 1h;

[0023] b. The vacuum hot pressing process is adopted, the sintering temperature is 640°C, the sintering pressure is 23 MPa, and the holding time is 10 minutes.

Embodiment 3

[0025] a. Wet the diamond with liquid paraffin, add metal powder, copper-cerium alloy, TS-1 titanium-silicon molecular sieve, mix in a high-energy mixer for 20 hours, and mix well; each raw material is 12.39% by weight respectively Granules, 41.27% Fe, 33.93% Cu, 6.34% Sn, 1.76% Cu-Ce, 1.31% Ni, 3% TS-1 titanium-silicon molecular sieve; the TS-1 titanium-silicon molecular sieve is obtained through the following method: 200-300nm TS-1 titanium-silicon molecular sieves were immersed in 8% cerium nitrate solution in acetone for 4 hours, filtered, and then slowly heated and dried at a drying rate of 20°C / h, raised to 600°C, and kept for 1 hour;

[0026] b. Vacuum hot pressing process is adopted, the sintering temperature is 650°C, the sintering pressure is 24MPa and the holding time is 8min.

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PUM

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Abstract

The invention discloses a diamond grinding wheel for metal binding agent. The diamond grinding wheel for metal binding agent is characterized bu being made up of metal powder, copper-cerium alloys, pore-forming agents, TS-1 titanium silicalite molecular sieves and diamond composite abrasive grains; the metal powder is iron powder, copper powder, nickel powder and tin powder; the pore-forming agents can be PE/CeO2/Cu compound; and the diamond composite abrasive grains are diamond/cerium oxide nuclear shell composite abrasive grains. According to the invention, the defects of poor self-sharpening property and low efficiency of the diamond grinding wheel for the metal binding agent are overcome; and the diamond grinding wheel for the metal binding agent has good mechanical property and self-sharpening property, and is high in holding force of diamond, good in molding property and long in service life.

Description

technical field [0001] The invention belongs to the field of superhard material manufacture, and in particular relates to a metal-bonded diamond grinding wheel. Background technique [0002] The metal bond is a kind of bond that is usually used for superhard material abrasive products with alloy powder or metal powder as the bonding material. It adopts the process of powder metallurgy. The metal bond has high strength and high toughness, and has a large holding force on the abrasive grains. Therefore, the superhard abrasive tool of the metal bond has the characteristics of long service life and can withstand large grinding pressure. It has been widely used in the grinding of difficult-to-machine materials such as engineering ceramics, stone processing, optical glass, hard alloys and electronic components. However, metal bonded abrasives have disadvantages such as poor self-sharpening and easy clogging of the abrasive surface. Therefore, in the grinding process, the surface...

Claims

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Application Information

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IPC IPC(8): B24D3/10
CPCB24D3/10
Inventor 陈金身陈锋智红梅裴占柱樊雪琴董德胜张朝阳杜晓冉王林圣高正
Owner HENAN UNIVERSITY OF TECHNOLOGY
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