Integrated alignment packaging structure for detector circuit board and optical waveguide chip

Abstract

The invention relates to the technical field of chip packaging, in particular to an integrated alignment packaging structure for a detector circuit board and an optical waveguide chip. The integratedalignment packaging structure comprises the detector circuit board (1) and the optical waveguide chip (2); the detector circuit board (1) is inversely installed on the optical waveguide chip (2); thesurface, facing the detector circuit board (1), of the optical waveguide chip (2) is covered with a supporting body (3), and a welding point is pre-formed on the supporting body (3) and has a meltingstate for automatically correcting and aligning the detector circuit board (1) and the optical waveguide chip (2) and a fixing state for connecting the detector circuit board (1) and the optical waveguide chip (2) after being cured. The integrated alignment packaging structure for the detector circuit board and the optical waveguide chip is high in alignment precision and reliability and convenient to operate.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to an integrated alignment packaging structure of a detector circuit board and an optical waveguide chip. Background technique [0002] In recent years, with the explosive growth of solid-state lidar, the demand for solid-state optical waveguide modules has also increased, and the requirements have become more stringent. Low cost, high speed, and high reliability have become the constant pursuit of innovation. At present, mainstream packaging methods are based on packages formed by combinations of reflective prisms, lenses, filters, or metal supports. The packaging process includes complex optical path designs. , cumbersome and non-reproducible coupling and alignment process, making the cost of the optical module high and the reliability low. [0003] Since the light output from the phase monitoring point on the surface of the optical waveguide chip has a certain divergence,...

AI Technical Summary

Problems solved by technology

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the defects of large human error, low precision and poor reliability in the alignment of the detector circuit board and the optical waveguide chip in the prior art, so as to provide a high alignment precision and reliability, easy to operate Convenient and fast integrated alignment package structure of detector circuit board and optical waveguide chip

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