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A method of wire-cutting artificial diamond wire drawing die

A technology of artificial diamond and wire drawing dies, which is applied in metal wire drawing, manufacturing tools, metal processing equipment, etc., can solve the problems of low processing efficiency, large hole shape deviation, large fluctuation of height, angle, shape, etc., and achieve high production efficiency , long service life and consistent hole structure

Active Publication Date: 2020-08-21
安徽聚芯智造科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Using this method to process a mold requires 20-30 times of manual grinding, and it is difficult to ensure that the angle of grinding is the same each time, which eventually leads to large fluctuations in the height, angle, and shape of each area of ​​the inner hole of the mold core. For example, the location of the sizing area is not on the same horizontal line
These are the main reasons for the large deviation of the inner hole of the domestic mold and the low life.
In addition, the processing efficiency is low, and it takes 1-2 days to process a mold core on average, which is time-consuming and laborious

Method used

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  • A method of wire-cutting artificial diamond wire drawing die

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Step 1, using a laser machine to perforate the artificial diamond blank, the diameter of the obtained laser hole is 0.2mm larger than the diameter of the wire cutting wire used for wire cutting;

[0021] Step 2, using a thin steel wire coated with oil-tuned diamond powder to pass through the laser hole, and then grinding the laser hole through the thin steel wire to remove the carbonized layer inside the laser hole due to laser perforation. Grinding refers to the relative movement between the thin steel wire and the laser hole, and the grinding time is about 2 minutes. The oil-adjusted diamond fine powder is blended with low-viscosity transformer oil to form 5# diamond fine powder, and a stable mixture is formed by stirring.

[0022] Step 3, fixing the synthetic diamond blank on the working table of the wire cutting machine, performing wire cutting on the inner side of the laser hole according to the processing program set in the wire cutting machine to obtain an inner ...

Embodiment 2

[0032] Step 1, using a laser machine to perforate the artificial diamond blank, the diameter of the obtained laser hole is 0.3mm larger than the diameter of the wire cutting wire used for wire cutting;

[0033] Step 2, using a thin steel wire coated with oil-tuned diamond powder to pass through the laser hole, and then grinding the laser hole through the thin steel wire to remove the carbonized layer inside the laser hole due to laser perforation. Grinding refers to the relative movement between the thin steel wire and the laser hole, and the grinding time is about 3 minutes.

[0034] Step 3, fixing the synthetic diamond blank on the working table of the wire cutting machine, performing wire cutting on the inner side of the laser hole according to the processing program set in the wire cutting machine to obtain an inner hole with a preliminary hole structure.

[0035] During the wire cutting process, the wire cutting wire passes through the laser hole, and the wire cutting wir...

Embodiment 3

[0043]Step 1, using a laser machine to perforate the artificial diamond blank, the diameter of the obtained laser hole is 0.4mm larger than the diameter of the wire cutting wire used for wire cutting;

[0044] Step 2, using a thin steel wire coated with oil-tuned diamond powder to pass through the laser hole, and then grinding the laser hole through the thin steel wire to remove the carbonized layer inside the laser hole due to laser perforation. Grinding refers to the relative movement between the thin steel wire and the laser hole, and the grinding time is about 3 minutes.

[0045] Step 3, fixing the synthetic diamond blank on the working table of the wire cutting machine, performing wire cutting on the inner side of the laser hole according to the processing program set in the wire cutting machine to obtain an inner hole with a preliminary hole structure.

[0046] During the wire cutting process, the wire cutting wire passes through the laser hole, and the wire cutting wire...

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Abstract

The invention relates to a method for wire-cutting machining of an artificial diamond wire-drawing die. The method comprises the steps: an artificial diamond blank is perforated through a laser machine; a thin steel wire coated with oil adjusting diamond micro powder is utilized to penetrate through a laser hole, and then a carbonized layer on the inner side of the laser perforated hole is removedthrough polishing of the thin steel wire; the artificial diamond blank is fixed to a workbench of a wire cutting machine, and according to a machining procedure set in the wire cutting machine, the inner side of the laser hole is subjected to wire cutting to obtain an inner hole with an initial hole-type structure; the two ends of the inner hole are ground through grinding needles on an ultrasonic grinding machine correspondingly; and polishing treatment is conducted on the ultrasonic grinding machine through the grinding needles to obtain a wire-drawing hole with a target hole-type structure. The wire-drawing die machined through the method is high in production efficiency, consistent in hole-type structure and long in service life.

Description

technical field [0001] The invention belongs to the field of diamond wire drawing die manufacturing, in particular to a method for wire-cutting an artificial diamond wire drawing die. Background technique [0002] Patent CN201711480149.4 discloses a high-precision and high-luminosity flat polycrystalline wire drawing die. The polycrystalline core in the mold is composed of artificial diamond. At present, most of the inner holes of the cores of domestic wire drawing dies are still arc-shaped, and the quality of wire drawing products fluctuates greatly, especially in the high-end wire market, which completely loses the ability to compete with foreign molds. The traditional domestic mold core processing method is laser perforation, and then manual shaping and rough machining of the laser hole to obtain the corresponding inner hole. Using this method to process a mold requires 20-30 times of manual grinding, and it is difficult to ensure that the angle of grinding is the same e...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B21C3/18
CPCB21C3/18
Inventor 陈彬程积龙赵俊钱立海王剑钊刘洋曹磊
Owner 安徽聚芯智造科技股份有限公司
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