A mosaic method suitable for products with a diameter or thickness less than 2mm
A product, thermal inlay technology, applied in the field of inlay, can solve the problems of sample deflection, inability to accurately test and analyze, failure analysis of samples and internal organizational structure morphology, etc., to achieve the effect of accurate analysis data
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[0030] This embodiment provides an inlay method suitable for products with a diameter or thickness less than 2mm, which specifically includes the following steps:
[0031] (1) Choose the mosaic method according to the product requirements, such as semiconductors, mild steel, etc., which will be damaged when heated, choose cold mosaic, general steel, etc. choose hot mosaic, and choose according to the needs of the product;
[0032] (2) Spread the prepared 0.85mm sample sheet and the 0.3mm diameter wire-drawn sample in a metallographic mounting machine with an inner mold of 30mm preheated for 5 minutes, and then put 7-10g of thermal mounting powder (the thermal mounting powder is phenolic The mixture of plastic powder, bakelite powder and electric jade powder, hot mosaic powder is already in good proportion when you buy it, and the hot mosaic powder with such ingredients in it is used) to form a 5mm high sample, close the lid, and apply pressure , 150 degrees heat preservation f...
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