Transparent conductive film substrate and manufacturing method thereof
A technology of a transparent conductive film and a manufacturing method, which is applied in the manufacture of cables/conductors, conductive layers on insulating carriers, circuits, etc., can solve the problems of incomplete contact between insulating glue and circuits, bubbles on the surface of products, defects, etc.
Active Publication Date: 2019-05-10
INTERFACE TECH CHENGDU CO LTD +2
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Problems solved by technology
[0002] After the FOC (Bumping process flow) process, the transparent conductive film substrate needs to be coated with insulating glue for line protection. In the existing substrate, the insulating glue is usually applied by a dispenser, and the insulating glue layer coated on the substrate is subject to dots. Due to the influence of various parameters of the melter, it is difficult to accurately control the thickness of the insulating adhesive layer, and it is easy to cause defective products due to excessive thickness of the insulating adhesive layer, such as bubbles on the surface of the product; if the dispensing space reserved for the substrate is too narrow, it may Because there is not enough space for dispensing, the insulating glue is not completely in contact with the line, which is not conducive to protecting the line
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[0029] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.
[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terminology used herein in the description of the present invention is only for the purpose of describing specific embodiments, and is not intended to limit the present invention.
[0031] figure 1 It is a manufacturing method of a transparent conductive film s...
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The invention relates to a transparent conductive film substrate and a manufacturing method thereof, wherein the method comprises the following steps: printing an insulating adhesive layer on the substrate by a printing process; providing a circuit board on one side of the printed insulating adhesive layer, and making the circuit board connected to the insulating adhesive layer; providing an optical adhesive layer on the other side of the insulating adhesive layer, and making the thickness of the optical adhesive layer greater than that of the insulating adhesive layer. The manufacturing method of the transparent conductive film substrate prints an insulating adhesive layer on the substrate by a printing process and obtains a precisely controlled thickness of the insulating adhesive layerto prevent the thickness of the insulating adhesive layer from being greater than that of the optical adhesive layer, and enables the circuit board to be connected to the insulating adhesive layer toprotect the lines on the circuit board, without affecting the coating of the insulating adhesive layer and the effect thereof even if the frame of the substrate is narrow.
Description
technical field [0001] The invention relates to the field of touch screens, in particular to a transparent conductive film substrate and a manufacturing method thereof. Background technique [0002] After the FOC (Bumping process flow) process, the transparent conductive film substrate needs to be coated with insulating glue for line protection. In the existing substrate, the insulating glue is usually applied by a dispenser, and the insulating glue layer coated on the substrate is affected by the dots. Due to the influence of various parameters of the melter, it is difficult to accurately control the thickness of the insulating adhesive layer, and it is easy to cause defective products due to excessive thickness of the insulating adhesive layer, such as bubbles on the surface of the product; if the dispensing space reserved for the substrate is too narrow, it may Because there is not enough space for dispensing, the insulating glue is not completely in contact with the circ...
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IPC IPC(8): H01B5/14H01B13/00
Inventor 叶嘉浤张菁李璟林黄彦衡
Owner INTERFACE TECH CHENGDU CO LTD