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An electronic package and method of fabricating thereof

A technology for electronic packaging and electronic components, which is applied in the manufacturing of electrical components, electrical solid-state devices, semiconductor/solid-state devices, etc., which can solve the problem of difficulty in increasing the layout area, inability to meet the needs of antenna operation, and inability to increase the length of the antenna structure 12, etc. problem, to achieve the effect of increasing the bandwidth

Active Publication Date: 2019-05-14
SILICONWARE PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the existing wireless communication module 1, because the antenna structure 12 is planar, when the length of the antenna structure 12 needs to be increased, it is necessary to increase the layout area on the surface of the substrate 10 (where the packaging material 13 is not formed). area) to form the antenna body 120, but the length and width of the substrate 10 are fixed, so it is difficult to increase the area of ​​the layout area, resulting in the inability to increase the length of the antenna structure 12, and unable to meet the requirements of the antenna operation

Method used

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  • An electronic package and method of fabricating thereof
  • An electronic package and method of fabricating thereof
  • An electronic package and method of fabricating thereof

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Embodiment Construction

[0064] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0065] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. The disclosed technical content must be within the scope covered. At the same time, terms such as "above", "first", "second" and ...

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Abstract

An electronic package and a method for fabricating the same are provided. The method includes disposing an antenna substrate on a package structure through a plurality of conductive elements. The antenna substrate has an antenna layer and the package structure has an electronic component. As such, an antenna length can be designed according to the requirement of antenna operation, without increasing the area of the package structure.

Description

technical field [0001] The invention relates to an electronic package, especially an electronic package with an antenna structure and a manufacturing method thereof. Background technique [0002] With the vigorous development of the electronic industry, electronic products are gradually moving towards the trend of multi-function and high performance. At present, wireless communication technology has been widely used in various consumer electronic products to receive or send various wireless signals. In order to meet the appearance design requirements of consumer electronics products, the manufacture and design of wireless communication modules are developed towards light, thin, short and small requirements. Among them, the planar antenna (Patch Antenna) is small in size, light in weight and It is widely used in wireless communication modules of electronic products such as cell phones and personal digital assistants (PDAs). [0003] figure 1 It is a three-dimensional schem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/488H01L23/58H01L21/60H01Q1/22
CPCH01L2224/18H01Q1/2283H01Q9/0414H01Q21/065H01L21/6835H01L2221/68345H01L2221/68359H01L23/3128H01L23/66H01L2223/6677H01L23/5389H01L23/49816H01Q9/0407H01Q1/38H01L23/49827H01L21/56H01L21/4857H01L23/49822
Inventor 方柏翔陈冠达卢盈维
Owner SILICONWARE PRECISION IND CO LTD
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