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OLED display panel and fabrication method thereof

A technology for display panels and substrates, applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems such as organic light-emitting layer failure, water and oxygen ingress, and poor reliability of TFE, and achieve enhanced water and oxygen resistance capabilities , avoid poor reliability, and improve the effect of encapsulation

Active Publication Date: 2019-05-17
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] One aspect of the present invention is to provide an OLED display panel, which adopts a new type of packaging structure to solve the problem of poor TFE reliability of medium and large-sized OLED panels, which easily leads to the entry of water and oxygen, and then makes the organic light-emitting layer invalid, and improves its location. Water and oxygen barrier ability of OLED display panel packaging structure

Method used

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  • OLED display panel and fabrication method thereof
  • OLED display panel and fabrication method thereof
  • OLED display panel and fabrication method thereof

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Embodiment Construction

[0036] The technical solution of an OLED display panel and its manufacturing method involved in the present invention will be further described in detail with reference to the accompanying drawings and embodiments.

[0037] see figure 1 As shown, an embodiment of the present invention provides an OLED display panel, which includes a TFT substrate 10 . Wherein the TFT substrate 10 is provided with an OLED device layer 20 and a TFE encapsulation layer, wherein the TFE encapsulation layer includes alternately arranged inorganic material layers 60 and organic material layers 62 .

[0038] Wherein the two ends of the TFT substrate 10 are oppositely provided with a first retaining wall 30 and a second retaining wall 40 arranged inside the first retaining wall 30 , wherein the first retaining wall 30 and the second retaining wall 40 are An encapsulation glue layer 50 is also provided. Wherein the TFE encapsulation layer is arranged between the first retaining wall 30, the second re...

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Abstract

The invention provides an OLED display panel. The OLED display panel comprises a TFT substrate, wherein first baffle walls are respectively arranged at two ends of the TFT substrate, a package glue layer is arranged on each first baffle wall, an OLED device layer is arranged on the TFT substrate between the two first baffle walls, a TFE package layer is arranged on the OLED device layer and is arranged between the two first baffle walls and the two package glue layers arranged on the two first baffle walls. In the OLED display panel, a novel package structure is employed, the water and oxygenblocking capability of the OLED display panel package structure can be improved aiming at the problems that a large-size OLED panel is poor in TFE reliability, water and oxygen easily enter and an organic light-emitting layer is further in failure.

Description

technical field [0001] The invention relates to the field of display technology, in particular, an OLED display panel and a preparation method thereof. Background technique [0002] It is known that organic light-emitting diode displays have self-illumination, low driving voltage, high luminous efficiency, short response time, high definition and contrast, nearly 180° viewing angle, wide operating temperature range, and can realize flexible display and large-area full-color display, etc. With many advantages, it is widely used in the fields of display, lighting and smart wear. [0003] Specifically, the OLED device is usually arranged on a thin film transistor array substrate (TFT substrate for short), including an anode, a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, an electron transport layer, and an electron transport layer sequentially formed on the TFT substrate. injection layer and cathode. Wherein the T...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L27/32H01L51/56
Inventor 曾宪祥
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD