Method for making aperture structure of organic light-emitting panel and organic light-emitting panel

Abstract

A method for manufacturing an aperture structure of an organic light-emitting panel, comprising forming an organic film layer on a glass substrate to form a base substrate; forming an array substrate layer on the organic film layer; The laser cleaning process is used to penetrate the array substrate layer and the organic film layer, and then form a slot surrounded by the array substrate layer and the organic film layer. On the array substrate layer with slot holes, the metal mask and electroluminescent material are used to carry out evaporation process to form the whole surface organic light emitting layer. A thin film encapsulation process is performed by using a metal photomask, and a thin film encapsulation layer is formed. The coating and curing process of water-absorbing encapsulant is carried out directly on the cross-section of the slot. A laser lift-off process is performed on the glass substrate, and the film layer structure corresponding to the bottom of the slot hole is removed, so that the slot hole penetrates the glass substrate.

Description

【Technical field】 [0001] The present invention relates to a display technology, in particular to a method for manufacturing an aperture structure of an organic light-emitting panel and the organic light-emitting panel. 【Background technique】 [0002] With the continuous development of science and technology, people have higher and higher requirements for display devices. As we all know, an organic light emitting diode (OLED) display device has attracted widespread attention because of its narrow frame, light weight, rollability, and easy portability. Nowadays, the design of "full screen" has become the mainstream of the times, and all suppliers are focusing on the research and development of full-screen products with a higher screen-to-body ratio. The notch (Notch) and round hole cutting (O-Cut) designs that have emerged recently, compared with the two, "O-Cut" is closer to the full-screen effect, and the size of the O-Cut only considers the front camera. Can. Therefore, ...

AI Technical Summary

Problems solved by technology

For the O-Cut panel, there are two main problems in the cutting process: First, because the electroluminescence (EL) organic film layer is formed by evaporation using a metal mask, the edge section of the O-Cut removal area position, there will be an electroluminescent organic layer, which will cause water vapor to invade from this position, making the panel invalid

Secondly, although Array's inorganic layer can be designed to avoid, but TFE uses a metal mask for chemical vapor deposition (CVD), the inorganic layer of TFE cannot be avoided, and it is easy to cause cracks in the inorganic layer of TFE during the cutting process. Cracks may propagate, causing package failure

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