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Apparatus for processing substrates or wafers

A technology of processing chambers and vacuum devices, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as reducing the yield rate of semiconductor devices or flat-panel devices

Inactive Publication Date: 2019-05-21
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During vacuum processing, undesired by-products are generated and become particles that degrade the yield of semiconductor devices or flat panel devices

Method used

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  • Apparatus for processing substrates or wafers
  • Apparatus for processing substrates or wafers
  • Apparatus for processing substrates or wafers

Examples

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Embodiment Construction

[0027] The following disclosure provides many different embodiments or examples for implementing different features of the invention. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only and are not intended to limit the invention. For example, the dimensions of the elements are not limited to the disclosed ranges or values, but may depend on process conditions and / or desired properties of the device. In addition, in the following description, forming a first component on or on a second component may include an embodiment in which the first component and the second component are formed in direct contact, and may also include an embodiment in which an additional component may be formed between the first component and the second component. components so that the first component and the second component may not be in direct contact with each other. Various features may be arbitrarily drawn in...

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Abstract

A vacuum apparatus includes process chambers, and a transfer chamber coupled to the process chambers. The transfer chamber includes one or more vacuum ports, thorough which a gas inside the transfer chamber is exhausted, and vent ports, from which a vent gas is supplied. The one or more vacuum ports and the vent ports are arranged such that air flows from at least one of the vent ports to the oneor more vacuum ports are line-symmetric with respect to a center line of the transfer chamber. The embodiments of the invention also relate to a vacuum apparatus for processing substrates or wafers.

Description

technical field [0001] Embodiments of the present invention relate to vacuum apparatus, and more particularly, to vacuum apparatus for processing wafers or substrates. Background technique [0002] Semiconductor manufacturing processes or flat panel display devices (eg, liquid crystal displays) require various vacuum processes such as film deposition processes and etching processes. During the vacuum process, undesired by-products are generated and become particles that degrade the yield of semiconductor devices or flat panel devices. Therefore, controlling particles caused by by-products is one of the problems to be solved in semiconductor device manufacturing operations and / or flat panel display manufacturing operations. Contents of the invention [0003] An embodiment of the present invention provides a vacuum apparatus, comprising: a processing chamber; a transfer chamber connected to the processing chamber, wherein: the transfer chamber includes: one or more vacuum p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67161H01L21/67167H01L21/6719H01L21/67017H01L21/67196H01L21/67201H01L21/67126
Inventor 殷立钊邱钰凌杨裕隆林鸿彬
Owner TAIWAN SEMICON MFG CO LTD
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