An assembling method for reducing the height of a camera module and the camera module

A technology of a camera module and an assembly method, which is applied in the directions of image communication, radiation control device, color TV components, etc., can solve the problem that the height of the camera module is difficult to meet the requirements, and achieve the effect of reducing the height

Pending Publication Date: 2019-05-21
GALAXYCORE SHANGHAI
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The height of the camera module packaged by this method is difficult to meet the demand

Method used

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  • An assembling method for reducing the height of a camera module and the camera module

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Embodiment Construction

[0026] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar extensions without violating the connotation of the present invention, so the present invention is not limited by the specific implementations disclosed below.

[0027] Secondly, the present invention is described in detail by means of schematic diagrams. When describing the embodiments of the present invention in detail, for convenience of explanation, the schematic diagrams are only examples, which should not limit the protection scope of the present invention.

[0028] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and understandable, the following in conjunction with the attached figure 1 The assembly method for reduc...

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Abstract

The invention relates to an assembling method for reducing the height of a camera module and the camera module, and the method comprises the steps: providing an image sensor chip which is provided with a metal lead with one end bonded to a chip bonding pad and the other end suspended; Providing a frame, and bonding the image sensor chip and the frame into a packaging body; Providing a printed circuit board with a through hole or a groove; And assembling the packaging body on the printed circuit board, enabling the bottom surface of the chip to be lower than the upper surface of the printed circuit board, enabling the suspension end of the metal wire to be electrically connected with a bonding pad of the printed circuit board through welding, and reducing the height of the module.

Description

technical field [0001] The invention relates to the technical field of image sensor chip packaging, in particular to an assembly method for reducing the height of a camera module and the camera module. Background technique [0002] An image sensor is a sensor that can sense optical image information and convert it into a usable output signal. The image sensor chip is easily polluted by the external environment during the working process, so the image sensor chip needs to be packaged so that the image sensor chip is in a sealed environment. , so as to avoid the influence of the external environment on the image sensor chip. At present, the packaging of the image sensor chip mainly adopts the following method: the image sensor chip is fixed on the circuit board, the metal wires are respectively bonded to the chip and the circuit board by wire-bonding technology, and then the chip is packaged with the shell. Up, the infrared cut filter and lens parts are assembled in the housi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/225H01L27/146
Inventor 杜柯赵立新侯欣楠
Owner GALAXYCORE SHANGHAI
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