PCB processing method capable of lessening layer deviation phenomenon caused after lamination
A technology of a PCB board and a processing method is applied in the field of PCB board processing to improve the layer deviation phenomenon after lamination, and can solve the problems of high scrap rate, inaccurate positioning of target holes, expansion and shrinkage of multi-layer boards, etc.
Inactive Publication Date: 2019-05-21
深圳市泰科思特精密工业有限公司
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Problems solved by technology
However, the finished PCB board is just after high-temperature pressing, and the temperature of the board is still about 40°, and the drilling process is carried out to process the drilling target holes. The expansion and contraction of the laminate board, in the subsequent drilling process, the phenomenon of inaccurate target hole positioning and poor drilling processing often occurs, which leads to a very high scrap rate in the subsequent drilling process
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[0024] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0025] see figure 1 , the present invention provides a PCB board processing method for improving the lamination phenomenon, comprising the following steps:
[0026] Step S1, forming the PCB substrate after pressing the PCB inner layer substrate. Specifically, in this embodiment, the step S1 specifically includes the following steps: step S11, heating to melt the prepreg to make it fluid; step S12, pressing the melted prepreg to form a solidified sheet, and simultaneously etching the inner layer The finished board and copper foil are glued together to form the PCB substrate, and the PCB substrate is a multilayer board. The specific numerical range of heating and pressing needs to be set according to the type of plastic material used in the PCB inner substrate.
[0027] Step S2 , using X-ray to capture and align the holes in the inner layer ...
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The invention discloses a PCB processing method capable of lessening layer deviation phenomenon caused after lamination. The method comprises the following steps: S1, laminating a PCB inner layer substrate to form a PCB substrate; S2, performing alignment for inner layer hole positions of the PCB substrate; S3, cutting and grinding the PCB substrate to form a cut and ground PCB; S4, drilling targets on the cut and ground PCB, and forming a PCB substrate with fixed holes; S5, drilling holes on the PCB substrate with fixed holes, drilling through circuits of internal and external layers and forming a PCB. In the PCB processing method, firstly, alignment and cutting and grinding working procedures are executed, then, the working procedure of drilling targets is executed, cooling time of the PCB substrate formed after thermal lamination is prolonged, a problem of expansion and contraction of the multi-layer PCB substrate caused by expansion caused by heat and contraction caused by cold while performing the working procedure of drilling targets is reduced, phenomenon of inaccurate target hole locating and bad drilling hole processing in the following hole drilling procedures is reduced,and consequently, hole drilling yield is improved.
Description
technical field [0001] The invention relates to the technical field of PCB board processing and manufacturing, in particular to a PCB board processing method for improving the phenomenon of layer deviation after lamination. Background technique [0002] At present, the processing process of PCB boards is usually: pressing - X-ray drilling target - alignment - board cutting and edging, etc. This process shortens the cooling time of PCB boards after thermal pressing. However, the finished PCB board is just after high-temperature pressing, and the temperature of the board is still about 40°, and the drilling process is carried out to process the drilling target holes. The expansion and contraction of the laminate boards, in the subsequent drilling process, the phenomenon of inaccurate target hole positioning and poor drilling processing often occurs, which leads to a high scrap rate in the subsequent drilling process. [0003] Therefore, there are deficiencies in the prior art...
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IPC IPC(8): H05K3/46
Inventor 唐志锋
Owner 深圳市泰科思特精密工业有限公司