A high-purity gas cylinder grinding process

Abstract

The invention discloses a high-purity gas cylinder grinding and manufacturing process. The high-purity gas cylinder grinding and manufacturing process is characterized in that inner wall of the high-purity gas cylinder is mechanically repaired to the inner wall without wrinkles, bulges, lines and pits, the high-purity gas cylinder after mechanical polishing is subjected to coarse grinding and finegrinding in sequence, the roughness of the inner wall of the gas cylinder after fine grinding is not greater than 0.3 micron; a grinding device is composed of a vibrator and a grinding wheel, the grinding wheel is mounted at the end of a vibrating rod of the vibrator, the mechanical grinding machine is performed on the inner wall of the high-purity gas cylinder by adopting the grinding wheel of the grinding device, the finish of the inner wall of the high-purity gas cylinder after mechanical polishing is 14.9 to 15.1 micron. The high-purity gas cylinder grinding and manufacturing process canquickly enable the roughness of the inner wall of the gas cylinder to reach the high-purity gas filling requirement.

Description

technical field [0001] The invention relates to the technical field of grinding the inner wall of a high-purity gas cylinder, in particular to a grinding process for a high-purity gas cylinder. Background technique [0002] The statements herein merely provide background information related to the present invention and may not necessarily constitute prior art. [0003] The electronics industry is a high-tech industry that promotes the development of science and technology today. Due to the variety of gases used and high quality requirements, they are different from gases used in other fields. People collectively refer to these gases used in the electronics industry as electronic special gases. It is a rising high-tech industry with high technology content, high investment and high additional value. The application fields of electronic special gases are mainly in the four major fields of semiconductor integrated circuit manufacturing, amorphous silicon solar cells, liquid cr...

AI Technical Summary

Problems solved by technology

The inner surface roughness of the ordinary gas cylinder type gas cylinder is Sa2.5, which cannot be filled with high-purity gas

[0004] According to the high-purity gas cylinder inner wall grinding process known to the inventor of the present invention, rough grinding and fine grinding are directly carried out, and the grinding efficiency of this process is relatively low

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