A multilayer fpc
A reference layer and intermediate layer technology, applied in the direction of printed circuit components, etc., can solve the problems of uncompact connection between module PCB and optical devices, long process steps, and improve work efficiency, so as to improve integrity, improve transmission quality, and achieve impedance matching Effect
Active Publication Date: 2021-08-10
GUANGXUN SCI & TECH WUHAN
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Problems solved by technology
[0005] The technical problem to be solved by the present invention is to solve the problem that the integrated optical device in BOX hermetic packaging in the prior art adopts two types of FPC to transmit RF high-speed signal and DC control signal and connect with the module PCB and the optical device respectively, resulting in poor connection between the module PCB and the optical device Compact, long process links, not conducive to improving work efficiency
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Embodiment 1
[0050] Embodiment 1 of the present invention provides a multi-layer FPC, refer to figure 1 , including RF high-speed signal layer 1, GND reference layer 2 and DC control signal layer 3;
[0051] The RF high-speed signal layer 1 is used to transmit RF high-speed signals;
[0052] The DC control signal layer 3 is used to transmit DC control signals;
[0053]The GND reference layer 2 is used as the reference ground of the RF high-speed signal layer 1, and isolates the interference of the DC control signal on the RF high-speed signal, wherein the GND reference layer 2 is set on the RF high-speed signal between layer 1 and the DC control signal layer 3.
[0054] The multilayer FPC provided by Embodiment 1 of the present invention is respectively provided with an RF high-speed signal layer, a GND reference layer, and a DC control signal layer. The RF high-speed signal layer is used to transmit RF high-speed signals, and the DC control signal layer is used to transmit DC control si...
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Abstract
The invention discloses a multi-layer FPC, the multi-layer FPC is respectively provided with an RF high-speed signal layer, a GND reference layer and a DC control signal layer, the RF high-speed signal layer is used for transmitting RF high-speed signals, and the DC control signal layer is used for transmission The DC control signal, GND reference layer is used as the reference ground of the RF high-speed signal layer, and isolates the interference of the DC control signal to the RF high-speed signal. The multi-layer FPC provided by the present invention can meet the transmission requirements of RF high-speed signals and DC control signals at the same time, can effectively reduce the connection process link between the module PCB and the optical device, and is conducive to reducing the size of the optical module. Furthermore, the multi-layer FPC provided by the present invention realizes impedance matching of the RF high-speed signal at the bonding pad connection through the impedance matching design of the RF high-speed signal metallized via hole, and improves the transmission quality of the RF high-speed signal.
Description
【Technical field】 [0001] The invention relates to the technical field of optical communication high-speed signal transmission, in particular to a multilayer FPC. 【Background technique】 [0002] Since its inception, FPC (Flexible Printed Circuit, abbreviated as FPC) has been widely used in electronics, electrical appliances, automobiles and medical products due to its advantages of thinness, flexibility, small footprint and high degree of bending freedom. Especially in the field of optical communication, under the requirements of miniaturization, high integration and high speed of optoelectronic devices and optoelectronic modules, FPC applications are increasing, which also puts forward higher requirements for the high density and high reliability of FPC. Require. [0003] At present, the integrated optical devices conventionally used in BOX hermetic packaging use two types of FPC to transmit radio frequency (Radio Frequency, abbreviated as RF) high-speed signal and direct c...
Claims
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IPC IPC(8): H05K1/02
CPCH05K1/02
Inventor 吴杨张玉安
Owner GUANGXUN SCI & TECH WUHAN