Electronic equipment cooling device

Abstract

The invention discloses an electronic equipment heat radiation device, which comprises a first mounting plate and a second mounting plate. Fixed plates are respectively and fixedly installed on the opposite sides of the first mounting plate and the second mounting plate. Annular grooves are respectively arranged in the opposite sides of the two adjacent fixed plates. A heat radiation hood is rotationally installed in the two annular grooves, and a heat radiation cavity is arranged in the middle of the heat radiation hood. A driving motor is installed outside the first mounting plate. The motorshaft passes through the first mounting plate and extends into the heat radiation cavity, and a rotating body is installed at the extension end of the motor shaft. More than one fixed shaft sleeve isinstalled outside the rotating body, and a heat radiation blade is installed in each fixed shaft sleeve in a telescopic manner. The electronic equipment heat radiation device of the invention has very good heat radiation performance, and the dust on the heat radiation device can be removed without opening the equipment.

Description

technical field [0001] The invention relates to a cooling device, in particular to a cooling device for electronic equipment. Background technique [0002] In order to ensure the normal operation of the motherboard, various electronic devices often need to use cooling devices, and the current cooling devices generally include cooling fans, cooling wind shields and cooling blades. The cooling blades drive the air from the outside to the inside, and then from another Side discharge, so for a long time, a large amount of dust will adhere to the heat dissipation blades and the heat dissipation wind cover. After a long period of accumulation, the heat dissipation ability will become worse and worse. It is not possible to clean it, it is inconvenient to clean. And as long as the heat dissipation device dissipates heat by air flow, an additional radiator needs to be provided to dissipate heat, which is very complicated in structure and has many deficiencies. Contents of the inve...

AI Technical Summary

Problems solved by technology

[0002] In order to ensure the normal operation of the motherboard, various electronic devices often need to use cooling devices, and the current cooling devices generally include cooling fans, cooling wind shields and cooling blades. The cooling blades drive the air from the outside to the inside, and then from another Side discharge, so for a long time, a large amount of dust will adhere to the heat dissipation blades and the heat dissipation wind cover. After a long period of accumulation, the heat dissipation ability will become worse and worse. It is not possible to clean it, it is inconvenient to clean

Moreover, as long as the airflow dissipates heat in the cooling device, an additional radiator is required to dissipate heat. The structure is very complicated and there are many deficiencies.

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