Optical module packaging structure and optical module
A packaging structure and optical module technology, applied in the coupling of optical waveguides, etc., can solve the problems of increasing thermal resistance, narrow product operating temperature range, and difficulty in dissipating module heat, reducing thermal resistance, enhancing thermal conduction efficiency, and solving heat dissipation problems. effect of the problem
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[0032] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.
[0033] This embodiment is aimed at chips (such as optical transceiver chips, driver chips, etc.) that easily generate heat during operation of optical modules (such as optical transmitter modules, optical receiver modules, or optical transceiver modules). Such chips have relatively high temperature rise during operation. When the temperature reaches the limit value, the performance of the chip will deteriorate or stop running directly, which affects the normal operation of the optical module. In the past, the general miniaturized product size (for example, the length and width are both 16.4mm, and the thickness does not exceed 4mm). Under the restriction of ), an optical module packaging structure with efficient heat dissipation is proposed, such as figure 1 As shown, it includes a metal housing 100, a top cover 500, a bottom plate 700 a...
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