DIP production line management method and manufacturing end
A management method and production line technology, applied in manufacturing computing systems, data processing applications, business, etc., can solve problems such as inability to trace back, slow analysis progress, manufacturing process records, etc., to facilitate defect analysis and improve production yield Effect
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Embodiment 1
[0128] Please refer to figure 1 , Embodiment 1 of the present invention is:
[0129] A DIP production line management method, comprising the steps of:
[0130] S1. Receive the DIP production work order, generate and print the picking information for receiving DIP materials from the SMT temporary storage warehouse;
[0131] S2. Read the identity card of the production employee to obtain the unique identification information of the production identity, and obtain the unique identification information of the production equipment from the information of the production equipment used to process the material to be DIP;
[0132] S3. Scan the material barcode on the material to be DIP to obtain the material information, record the production quantity, quantity of defective products and description of the defect, and record the production quantity, quantity of defective products, description of the defect, production time, DIP production work order, material information, and productio...
Embodiment 2
[0149] Please refer to figure 1 , the second embodiment of the present invention is:
[0150] A DIP production line management method, on the basis of the first embodiment above, step S33 also includes:
[0151] Remove the wave soldering PCB information from the plug-in PCB information to obtain the bad PCB information of the plug-in, record the number of bad PCB information of the plug-in, and obtain the number of bad plug-in products;
[0152] Step S36 also includes:
[0153] Remove the sub-board PCB information from the wave soldering PCB information to obtain the wave soldering bad PCB information, record the number of wave soldering bad PCB information, and get the number of wave soldering bad products;
[0154] Step S39 also includes:
[0155] Remove the painted PCB information from the burned PCB information to obtain the bad burned PCB information, record the number of bad burned PCB information, and get the number of bad burned products;
[0156] After step S310, ...
Embodiment 3
[0158] Please refer to figure 1 , Embodiment three of the present invention is:
[0159] A DIP production line management method, on the basis of the first embodiment above, step S32 also includes:
[0160] Count the first plug-in PCB detected to obtain the plug-in detection sequence, obtain the bad position information of the inconsistent plug-in PCB on the plug-in detection sequence, and find the plug-in PCB information with the same position information as the bad position information from the plug-in sequence , marked as bad plug-in PCB information, add the bad plug-in PCB information to get the number of bad plug-in products, and the plug-in sequence is the plug-in PCB information arranged in order according to the plug-in time;
[0161] Step S35 also includes:
[0162] Count from the first piece of PCB that has been checked to get the welding inspection sequence, obtain the bad position information of the inconsistent cut PCB on the welding inspection sequence, and fin...
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