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Chip suction device and chip suction method thereof

A suction device and chip technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as particle residue, achieve uniform suction, reduce production costs, and reduce complexity

Inactive Publication Date: 2019-06-07
HUAIAN IMAGING DEVICE MFGR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the cut individual chip can be removed from the blue tape by sucking it with a rubber head, but the problem of particle residue is prone to occur

Method used

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  • Chip suction device and chip suction method thereof
  • Chip suction device and chip suction method thereof
  • Chip suction device and chip suction method thereof

Examples

Experimental program
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Embodiment Construction

[0026] In the prior art, it is usually necessary to grasp the packaged chip, but particles are often easily retained on the surface of the chip, resulting in damage to the chip.

[0027] refer to figure 1 , figure 1 It is a top view of a chip to be sucked in the prior art.

[0028] Specifically, the diced individual chips 101 are usually placed on the surface of the blue film 100 , and particles 102 are formed due to the dicing process.

[0029] refer to figure 2 , figure 2 It is a schematic diagram of a working scene of a chip picking device in the prior art.

[0030] The chip suction device generally includes a chip suction pipe 110 , a suction cup 111 is provided at the top of the first end of the chip suction pipe 110 , and the suction cup 111 can be used to suck the top surface of the chip 101 .

[0031] The inventors of the present invention have found through research that particles (such as debris produced during cutting) remain around the chip 101 and in the di...

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PUM

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Abstract

The invention relates to a chip suction device and a chip suction method thereof. The device comprises a chip suction part and a particle suction head part; the chip suction part comprises a chip suction pipeline; the first end of the chip suction pipeline is used for adsorbing the top surface of a chip to be sucked; the particle suction head part comprises a particle suction pipeline and a suction head connected with the first end of the particle suction pipeline; the suction head is used for containing the chip adsorbed by the first end of the chip suction pipeline; and the particle suctionpipeline is used for performing particle suction on the chip contained in the chip. By means of the scheme in the invention, the possibility that particles and scraps fall into the chip or an adjacentchip can be reduced; and the quality of the chip can be increased.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing equipment, in particular to a chip pickup device and a chip pickup method thereof. Background technique [0002] In the existing semiconductor packaging technology, the following steps are usually included: performing a dicing process on the wafer (Wafer) that has passed the test, cutting the wafer into small wafers (Die), and then packaging the wafer to form a chip (Chip). ). Furthermore, for the packaged chips, it is necessary to use a robotic arm to grab one by one, and this grabbing process can also be called wafer reorganization. [0003] In the prior art, the cut individual chip can be removed from the blue tape by suction with a rubber head, but the problem of particle residue is prone to occur. [0004] There is an urgent need for a chip suction device, which can avoid the influence of particles on the chip when picking up the chip. Contents of the invention [0005] The tec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683
Inventor 宋闯黄高田茂
Owner HUAIAN IMAGING DEVICE MFGR CORP
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