Unlock instant, AI-driven research and patent intelligence for your innovation.

Manufacturing method of stepped hole in PCB board and PCB board

A technology of a PCB board and a manufacturing method, which is applied in the field of microelectronics, can solve the problems of low yield rate of PCB boards, and achieve the effect of improving the yield rate

Active Publication Date: 2021-04-09
NEW FOUNDER HLDG DEV LLC +1
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the problem of low yield rate of PCB board caused by burrs in the empty bottom of the stepped hole in the existing process of making the stepped hole of the PCB, the application provides a method for manufacturing the stepped hole of the PCB board and the PCB board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method of stepped hole in PCB board and PCB board
  • Manufacturing method of stepped hole in PCB board and PCB board
  • Manufacturing method of stepped hole in PCB board and PCB board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention.

[0034] Printed Circuit Board (PCB for short) is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. Because it is made using electronic printing, it is called a "printed" circuit board.

[0035] With the development of PCB technology, PCB boards are used in all walks of life. In order to improve the wiring and device density requirements of the PCB board, the stepped hole structure has also been widely used in the design of the PCB board.

[0036] At present, the method of manufacturing stepped holes on PCB boards mainly adopts the back-drilling method. Specifically, first...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The manufacturing method of the stepped hole of the PCB board and the PCB board provided by the present invention reserve a blank area at the preset layer of the inner copper layer of the substrate of the PCB; drill holes along the axis of the blank area to form a hole with a stepped hole. A stepped hole with a hole structure; wherein, the stepped portion of the stepped hole is located in the blank area, and the axis of the stepped hole coincides with the axis of the blank area, thereby obtaining a PCB board with a stepped hole. Moreover, the PCB board obtained by the above-mentioned manufacturing method is less likely to have copper nodules during the process of forming the stepped holes of the PCB board due to the existence of the blank area structure, thereby improving the yield rate of the PCB board.

Description

technical field [0001] The invention relates to microelectronic technology, in particular to a method for manufacturing a stepped hole in a PCB board and the PCB board. Background technique [0002] With the development of Printed Circuit Board (PCB for short) technology, PCB boards are used in various industries. In order to improve the wiring and device density requirements of the PCB board, the stepped hole structure is also used in the design of the PCB board. [0003] The design and production of the existing stepped holes is to use a small diameter drill to drill through holes on the PCB substrate, and then use the controlled depth drill to drill a stepped hole that meets the requirements on the basis of the through holes, and then perform conventional copper sinking and electroplating To form a PCB board with stepped holes. [0004] However, since the substrate of the PCB is a multi-layer board structure, an inner copper layer is arranged between each layer. In the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
Inventor 秦运杰李晓
Owner NEW FOUNDER HLDG DEV LLC
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com