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An integrated circuit packaging board mounter

An integrated circuit and packaging board technology, applied in the field of integrated circuit packaging board mounters, can solve the problems of poor heat dissipation effect of integrated circuit packaging boards and poor installation effect of the mounter, and achieve the effects of good heat dissipation, convenient assembly and good heat dissipation

Active Publication Date: 2021-02-02
王晓青
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides an integrated circuit packaging board installer, which solves the problems of poor heat dissipation effect of the integrated circuit packaging board and poor installation effect of the installer

Method used

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  • An integrated circuit packaging board mounter
  • An integrated circuit packaging board mounter
  • An integrated circuit packaging board mounter

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0025] see Figure 1-3 , the present invention provides a technical solution: an integrated circuit package board installer, including an integrated circuit package board 1 and a mounting workbench 2, the integrated circuit package board 1 is placed on the installation workbench 2, and the integrated circuit package board 1 includes a base plate 101, substrate 102, heat-dissipating graphite film layer 104 and top plate 105, bottom plate 101, substrate 102, hea...

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Abstract

The invention discloses an integrated circuit packaging board installer, which comprises an integrated circuit packaging board and an installation workbench, the integrated circuit packaging board is placed on the installation workbench, and the integrated circuit packaging board includes a bottom plate, a substrate, and a heat-dissipating graphite film Layer and top plate, the bottom plate, substrate, heat-dissipating graphite film layer and top plate are arranged sequentially from bottom to top, the middle part of the heat-dissipating graphite film layer and the top plate is provided with an IC chip mounting groove, and an IC chip is placed on the top of the IC chip mounting groove. A chip, the bottom of the IC chip is provided with pin holes, and the bottom and top of the IC chip are provided with heat-conducting silica gel sheets. The invention relates to the technical field of integrated circuit packaging boards. The integrated circuit packaging board and its installer achieve the purpose of good heat dissipation and convenient installation of the integrated circuit packaging board. The packaging board with composite heat conduction structure and the heat dissipation cover on the packaging board have higher heat dissipation efficiency and improve the service life of the IC chip. Reduce the force of the push-down disc rubber disc to prevent damage.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to an integrated circuit packaging board installer. Background technique [0002] The electronic industry continues to reduce the size of electronic components and increase the functions of electronic components, which makes the functions and complexity of integrated circuits continue to increase. This trend also drives the packaging technology of integrated circuit components to develop towards the direction of small size, high pin count and high electrical / thermal performance, and conforms to predetermined industrial standards. Some existing integrated circuit packages are composed of substrates, IC chips and corresponding packaging glue. IC chips are sealed and fixed on the substrate through the packaging glue, and then wired on the upper part of the substrate. Although this structure is convenient and quick to package, the heat dissipation effect is poor. , The buff...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L23/10H01L23/367H01L23/373
Inventor 任飞
Owner 王晓青
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