Semiconductor device cooling device

A technology for heat sinks and semiconductors, which is applied to semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve problems such as high heat and failure, and achieve high heat transfer efficiency, low production cost, and avoid heat concentration. Effect

Pending Publication Date: 2019-06-14
四川长虹空调有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The technical solutions disclosed in the above-mentioned patents often only export the heat of the heat-generating device to the nearby air through the heat-conduct

Method used

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  • Semiconductor device cooling device
  • Semiconductor device cooling device

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Embodiment Construction

[0023] In order to facilitate understanding of the present invention, the present invention will be further described below in conjunction with the accompanying drawings.

[0024] Such as figure 1 As shown, the semiconductor device cooling device of the present invention exchanges heat with the semiconductor device 1 through the semiconductor cooling unit loop, and transfers the absorbed heat to the remote condenser 3 for release. The specific structure of the semiconductor cooling unit loop includes an evaporator 2, a condenser 3 and corresponding connecting pipelines, the evaporator 2 is in contact with and connected to the surface of the semiconductor device 1; the condenser 3 adopts a tubular structure, and the evaporator 2 can adopt a tubular structure Or cuboid structure, if the evaporator 2 adopts a tubular structure, the tube diameter of the condenser 3 is smaller than the tube diameter of the evaporator 2, in order to increase the heat transfer area, the surface of th...

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Abstract

The invention discloses a semiconductor device cooling device. The semiconductor device cooling device comprises at least one group of semiconductor cooling unit loop, wherein each semiconductor cooling unit loop comprises a condenser and an evaporator, the evaporator is connected with a surface of a semiconductor device, an outlet end of the evaporator communicates with an inlet end of the condenser, and the inlet end of the evaporator communicates with the condenser. Heat dissipated from the semiconductor device is absorbed by a liquid working medium in the evaporator, the liquid working medium is transmitted to the condenser for heat releasing after gasification by heating and then is converted to the liquid working medium again, the liquid working medium is discharged to the evaporator, and the liquid working medium capable of heat absorption is constantly provided for the evaporator by a capillary structure. By the semiconductor device cooling device, the heat dissipated from thesemiconductor device can be conveniently and efficiently transferred at a far distance, and the influence of heat concentration and ventilation unsmoothness on the performance of the semiconductor device is prevented; and moreover, an external mechanical device is not needed to provide power, and the semiconductor device cooling device is low in production cost and high in heat transmission efficiency.

Description

technical field [0001] The invention relates to the technical field of semiconductor heat dissipation systems, in particular to a semiconductor device heat dissipation device. Background technique [0002] A semiconductor device is an electronic device whose conductivity is between a good conductor and an insulator. It uses the special electrical characteristics of semiconductor materials to complete specific functions. It can be used to generate, control, receive, transform, amplify signals and perform energy conversion. Semiconductor devices are widely used in various fields of engineering technology, especially the application of semiconductor chips is the most common. At present, the application of semiconductor chips is represented by computer CPU, air conditioner IPM and PFC circuit power components, as well as lasers and display chips in laser projectors. These semiconductor devices generate a lot of heat in application with their high-performance work. In order to p...

Claims

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Application Information

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IPC IPC(8): H01L23/367H01L23/373H01L23/44
Inventor 李越峰袁竹张娣
Owner 四川长虹空调有限公司
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