Electronic device heat dissipation device based on ultrasonic energy converter

A technology of ultrasonic transducers and electronic devices, applied in the direction of electric solid devices, electrical components, semiconductor devices, etc., can solve the problems of noise, large volume, high energy consumption, etc., and achieve dust insensitivity, low power consumption, and reflection ability enhanced effect

Active Publication Date: 2019-06-14
PEKING UNIV SHENZHEN GRADUATE SCHOOL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The main technical problem to be solved by the present invention is how to overcome the problems of high energy consumption, large volume and noise influence existing in existing electronic device cooling devices

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  • Electronic device heat dissipation device based on ultrasonic energy converter
  • Electronic device heat dissipation device based on ultrasonic energy converter
  • Electronic device heat dissipation device based on ultrasonic energy converter

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Embodiment Construction

[0024] The present invention will be further described in detail below through specific embodiments in conjunction with the accompanying drawings. Wherein, similar elements in different implementations adopt associated similar element numbers. In the following implementation manners, many details are described for better understanding of the present application. However, those skilled in the art can readily recognize that some of the features can be omitted in different situations, or can be replaced by other elements, materials, and methods. In some cases, some operations related to the application are not shown or described in the description, this is to avoid the core part of the application being overwhelmed by too many descriptions, and for those skilled in the art, it is necessary to describe these operations in detail Relevant operations are not necessary, and they can fully understand the relevant operations according to the description in the specification and genera...

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Abstract

The invention discloses an electronic device heat dissipation device based on an ultrasonic energy converter. The electronic device heat dissipation device comprises one or multiple ultrasonic energyconverters arranged to close to a heat source formed by the electronic device; the ultrasonic energy converter is used for forming acoustic streaming in a disturbance way to perform heat dissipation on the electronic device; on the one hand, the ultrasonic energy converter is used as the power component of a heat exchange medium, so that the produced ultrasonic wave can disturb the heat exchange medium so as to form the acoustic streaming flowing through the electronic device heat source; compared with the traditional air-cooling and liquid-cooling and like heat dissipation way, the heat dissipation device has the advantages of being low in power consumption, silent, insensitive to the dust and high in reliability; on the other hand, the heat dissipation device can work as normal by arranging the ultrasonic energy converter on a medium channel passing through the heat source and through the supporting of a simple control circuit; the heat dissipation device has the features of being convenient for layout and simple in circuit, and the heat dissipation can be applied to the integrated circuit under multiple environments.

Description

technical field [0001] The invention relates to the technical field of semiconductor device heat dissipation, in particular to an electronic device heat dissipation device based on an ultrasonic transducer. Background technique [0002] With the development of integration technology and microelectronic packaging technology, the total power density of electronic devices continues to increase, while the physical size of electronic devices and electronic equipment tends to be smaller and miniaturized, and the heat generated accumulates rapidly, causing The heat flux density is also increasing, so the high temperature environment will definitely affect the performance of electronic devices and equipment, which requires a more efficient thermal control scheme. At present, the heat dissipation problem of electronic devices has evolved into a major focus of electronic devices and electronic equipment manufacturing. For example, in applications such as electric vehicles, smart grids...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/467H01L23/473H01L23/42
Inventor 金玉丰邱奕翔李楠
Owner PEKING UNIV SHENZHEN GRADUATE SCHOOL
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